TIDUFI0 May   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1  F29P32X
      2. 2.3.2  LM74930-Q1
      3. 2.3.3  WSS001
      4. 2.3.4  LM68645-Q1
      5. 2.3.5  TPS653860-Q1
      6. 2.3.6  DRV3263-Q1
      7. 2.3.7  DRV3233-Q1
      8. 2.3.8  DRV8263-Q1
      9. 2.3.9  DRV8243-Q1
      10. 2.3.10 TMAG6180-Q1
      11. 2.3.11 TCAN1043H-Q1
      12. 2.3.12 TCAN1043-Q1
      13. 2.3.13 LDC5072-Q1
    4. 2.4 System Design Theory
      1. 2.4.1 Hardware Design
        1. 2.4.1.1 Power Tree Design
        2. 2.4.1.2 PMIC Design
        3. 2.4.1.3 DC/DC Converter Design
        4. 2.4.1.4 Motor Gate Driver Design
        5. 2.4.1.5 Motor Phase Current Sensing
        6. 2.4.1.6 Overcurrent Protection for F29P32
        7. 2.4.1.7 Motor Driver Protection by PMIC
        8. 2.4.1.8 CAN Transceiver Design
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Getting Started Hardware
      1. 3.1.1 Board Power On Sequence
      2. 3.1.2 Test Conditions
      3. 3.1.3 Test Equipment Required for Board Validation
    2. 3.2 Test Results
      1. 3.2.1 Power on Sequence of PMIC
      2. 3.2.2 F29P32 Reset Sequence
      3. 3.2.3 25MHz Clock
      4. 3.2.4 Sequence to Use External 1.25V
    3. 3.3 Getting Started F29P32 Firmware
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
    2. 4.2 Software Files
    3. 4.3 Documentation Support
    4. 4.4 Support Resources
    5. 4.5 Trademarks
  11. 5About the Author

2.3.8 DRV8263-Q1

The DRV8263-Q1 is a wide-voltage, high-power fully integrated H-bridge driver for 24V and 48V automotive applications. Designed in a BiCMOS high-power process technology node, this device in a power package offers excellent power handling and thermal capability while providing compact package size, ease of layout, EMI control, accurate current sense, robustness, and diagnostic capability.

The device integrates a N-channel H-bridge, charge pump, high-side current sensing with regulation, current proportional output, and protection circuitry. The integrated sensing uses a current mirror, removing the need for shunt resistors, saving board area, and reducing system cost. A low-power sleep mode is provided to achieve low quiescent current.

The device offers voltage monitoring and load diagnostics, as well as protection features against overcurrent and overtemperature. Fault conditions are indicated on the nFAULT pin. The device is available in two variants: HW interface and SPI. The SPI variant offers more flex