SGZT005C February   2010  – July 2021 DP83848-EP , DP83848C , DP83848H , DP83848I , DP83848J , DP83848K , DP83848M , DP83848Q-Q1 , DP83848T , DP83848VYB , DP83848YB , TMS570LS3137-EP

 

  1. 1 Preface
  2. 2 Amplifiers
    1. 2.1 Op Amps
    2. 2.2 Instrumentation Amplifiers
    3. 2.3 Difference Amplifiers
    4. 2.4 Current Sense Amplifiers
    5. 2.5 Comparators
    6. 2.6 Special Function Amplifiers
  3. 3 Audio
    1. 3.1 Audio Op Amps
  4. 4 Clock and Timing
    1. 4.1 Clock Jitter Cleaners
    2. 4.2 Clock Buffers
  5. 5 Data Converters
    1. 5.1 ADCs
    2. 5.2 DACs
    3. 5.3 Digital Potentiometers (DigiPots)
  6. 6 Interface
    1. 6.1 CAN/LIN
    2. 6.2 Ethernet
    3. 6.3 HDMI/DVI/DP/MIPI (CSI/DSI)
    4. 6.4 LVDS/M-LVDS/PECL
    5. 6.5 RS-232
    6. 6.6 RS-485/RS-422
    7. 6.7 UART
    8. 6.8 1394
  7. 7 Isolation
    1. 7.1 Digital Isolators
    2. 7.2 Isolated Gate Drivers
  8. 8 Logic
    1. 8.1 Voltage Level Translation
    2. 8.2 Buffer/Driver
    3. 8.3 Transceivers
    4. 8.4 Gates
    5. 8.5 Flip-Flop/Latch/Register
    6. 8.6 Speciality Logic
    7. 8.7 Universal Bus Function
  9. 9 Motor Drivers
    1. 9.1 Brushless DC (BLDC) Motor Drivers
  10. 10Microcontrollers
    1. 10.1 MSP430 Ultra-low-power MCUs
    2. 10.2 C2000 Real-time Control MCUs
    3. 10.3 Hercules MCUs for Functional Safety
  11. 11Processors
    1. 11.1 Sitara Processors
    2. 11.2 Digital Signal Processors
  12. 12Power Management
    1. 12.1  Linear Regulators (LDO)
    2. 12.2  DC/DC Switching Regulators
    3. 12.3  Multi-channel ICs (PMIC)
    4. 12.4  Battery Management
    5. 12.5  Power Muxes
    6. 12.6  Low-side Switches
    7. 12.7  USB Power Switches and Charging Port Controllers
    8. 12.8  Offline and Isolated DC/DC Controllers and Converters
    9. 12.9  Gate Drivers
    10. 12.10 Voltage References
    11. 12.11 Supervisor and Reset IC
    12. 12.12 LED Driver
    13. 12.13 DDR Memory
    14. 12.14 Digital Power
  13. 13Sensors
    1. 13.1 Digital Temperature Sensors
    2. 13.2 Magnetic Sensor
  14. 14Switches and Multiplexers
    1. 14.1 Analog Switches/Muxes
    2. 14.2 Encoders and Decoders
  15. 15Important Notice

1 Preface

In 1994, a paradigm shift occurred within the defense community with the introduction of “Defense Acquisition Reform,” which had the objective to expand the consideration of commercial-off-the-shelf (COTS) components for defense equipment. In the years that followed both the avionics and defense industries were looking for viable approaches to procure COTS components while still ensuring that these components meet the critical performance, reliability and safety requirements their industries demanded. Texas Instrument’s enhanced product (-EP) plastic-encapsulated microcircuits (PEMs) portfolio is the solution. Beyond just meeting the reliability expectations for the PEMs semiconductors, we also complement this with extended device availability to match the expectation of the industry while enabling a low-cost portfolio for extensive use across these industries.

Our enhanced products portfolio mitigates the risks that the avionics and defense markets face with COTS integrated circuits (ICs) by:

  • Using the latest and most robust plastic encapsulation methodology to support the harsh environment needs.
  • Ensuring tin plating content is not above 97% to eliminate the risks related to time-dependent pin-to-pin metal shorts (aka tin whiskers) by assembling the device with NiPdAu plating or SnPb solder balls.
  • Using only gold (Au) bond wires to ensure the highest quality die to leadframe connection.
  • Performing extended 250 hours highly accelerated temperature and humidity stress testing (HAST) to demonstrate improved moisture resistance, extending both operational life and dormant storage capabilities.
  • Extending temperature ranges from -55°C to 125°C to enable the broadest possible use cases.
  • Ensuring a single controlled manufacturing baseline flow with a single wafer fab, assembly site and test site to ensure the applicability of customer’s qualification even over multi-decade programs.
  • Ensuring orderable (V62/xxxx) DLA vendor items drawings part numbers that eliminate the need specification source controlled drawings.
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Table 1-1 Enhanced Products New Device Qualification Matrix
Enhanced Products New Device Qualification Matrix
(Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed)
Description Condition Sample Size
(Allowed Rejects)		 Lots Required Test Method
Electromigration Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Wire Bond Life Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Electrical Characterization TI Data Sheet 15 3 N/A
Electrostatic Discharge Sensitivity HBM 3 units/voltage N/A EIA/JESD22-A114
or
ANSI/ESDA/JEDEC JS-001
CDM EIA/JESD22-C101
or
ANSI/ESDA/JEDEC JS-002
Latch-up Per Technology 3(0) 1 EIA/JESD78
Physical Dimensions TI Data Sheet 5(0) 1 EIA/JESD22- B100
Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51
Bias Life Test 125°C/1000 hours or equivalent 45(0) 3 JESD22-A108*
Biased Humidity**
or
Biased HAST**		 85°C/85%/1000 hours 77(0) 3 JESD22-A101*
130°C/85%/96 hours or 110°C/85%/264 hours JESD22-A110*
Extended Biased Humidity**
or
Extended Biased HAST**		 85°C/85%/2600 hours 77(-) 1 JESD22-A101*
130°C/85% /250 hours or 110°C/85%/687 hours JESD22-A110*
Unbiased HAST 130°C/85% /96 hours or 110°C/85%/264 hours 77(0) 3 JESD22-A.118*
Temperature Cycle -65°C to +150°C non-biased for 500 cycles 77(0) 3 JESD22-A104*
Solder Heat 260°C for 10 seconds 22(0) 1 JESD22-B106
Resistance to Solvents Ink symbol only 12(0) 1 JESD22-B107
Solderability Bake Preconditioning 22(0) 1 ANSI/J-STD-002
Flammability Method A / Method B 5(0) 1 UL94
Bond Shear Per wire size 5 units x 30(0) bonds 3 JESD22-B116
Bond Pull Strength Per wire size 5 units x 30(0) bonds 3 ASTM F-459 or TM2011
Die Shear Per die size 5(0) 3 TM 2019
High Temp Storage 150°C / 1,000 hours 15(0) 3 JESD22-A103*
Moisture Sensitivity Surface Mount Only 12 1 J-STD-020*
*Precondition performed per JEDEC Std. 22, Method A112/A113
**For information only