SBOSA15 September   2022 TMP1827

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (cont.)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  1-Wire Interface Timing
    7. 7.7  Security Engine Characteristics
    8. 7.8  EEPROM Characteristics
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Up
      2. 8.3.2  Power Mode Switch
      3. 8.3.3  Bus Pullup Resistor
      4. 8.3.4  Temperature Results
      5. 8.3.5  Temperature Offset
      6. 8.3.6  Temperature Alert
      7. 8.3.7  Standard Device Address
        1. 8.3.7.1 Unique 64-Bit Device Address and ID
      8. 8.3.8  Flexible Device Address
        1. 8.3.8.1 Non-Volatile Short Address
        2. 8.3.8.2 IO Hardware Address
        3. 8.3.8.3 Resistor Address
        4. 8.3.8.4 Combined IO and Resistor Address
      9. 8.3.9  CRC Generation
      10. 8.3.10 Functional Register Map
      11. 8.3.11 User Memory Map
      12. 8.3.12 SHA-256-HMAC Authentication Block
      13. 8.3.13 Bit Communication
        1. 8.3.13.1 Host Write, Device Read
        2. 8.3.13.2 Host Read, Device Write
      14. 8.3.14 Bus Speed
      15. 8.3.15 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Conversion Modes
        1. 8.4.1.1 Basic One-Shot Conversion Mode
        2. 8.4.1.2 Auto Conversion Mode
        3. 8.4.1.3 Stacked Conversion Mode
        4. 8.4.1.4 Continuous Conversion Mode
      2. 8.4.2 Alert Function
        1. 8.4.2.1 Alert Mode
        2. 8.4.2.2 Comparator Mode
      3. 8.4.3 Single-Wire Interface Communication
        1. 8.4.3.1 Bus Reset Phase
        2. 8.4.3.2 Address Phase
          1. 8.4.3.2.1 READADDR (33h)
          2. 8.4.3.2.2 MATCHADDR (55h)
          3. 8.4.3.2.3 SEARCHADDR (F0h)
          4. 8.4.3.2.4 ALERTSEARCH (ECh)
          5. 8.4.3.2.5 SKIPADDR (CCh)
          6. 8.4.3.2.6 OVD SKIPADDR (3Ch)
          7. 8.4.3.2.7 OVD MATCHADDR (69h)
          8. 8.4.3.2.8 FLEXADDR (0Fh)
        3. 8.4.3.3 Function Phase
          1. 8.4.3.3.1  CONVERTTEMP (44h)
          2. 8.4.3.3.2  WRITE SCRATCHPAD-1 (4Eh)
          3. 8.4.3.3.3  READ SCRATCHPAD-1 (BEh)
          4. 8.4.3.3.4  COPY SCRATCHPAD-1 (48h)
          5. 8.4.3.3.5  WRITE SCRATCHPAD-2 (0Fh)
          6. 8.4.3.3.6  READ SCRATCHPAD-2 (AAh)
          7. 8.4.3.3.7  COPY SCRATCHPAD-2 (55h)
          8. 8.4.3.3.8  READ EEPROM (F0h)
          9. 8.4.3.3.9  GPIO WRITE (A5h)
          10. 8.4.3.3.10 GPIO READ (F5h)
      4. 8.4.4 NVM Operations
        1. 8.4.4.1 Programming User Data
        2. 8.4.4.2 Register and Memory Protection
          1. 8.4.4.2.1 Register Protection
          2. 8.4.4.2.2 User Memory Protection
    5. 8.5 Programming
      1. 8.5.1 Single Device Temperature Conversion and Read
      2. 8.5.2 Multiple Device Temperature Conversion and Read
      3. 8.5.3 Register Scratchpad Update and Commit
      4. 8.5.4 Single Device EEPROM Programming and Verify
      5. 8.5.5 Single Device EEPROM Lock Operation
      6. 8.5.6 Multiple Device IO Read
      7. 8.5.7 Multiple Device IO Write and Read
    6. 8.6 Register Maps
      1. 8.6.1  Temperature Result LSB Register (Scratchpad-1 offset = 00h) [reset = 00h]
      2. 8.6.2  Temperature Result MSB Register (Scratchpad-1 offset = 01h) [reset = 00h]
      3. 8.6.3  Status Register (Scratchpad-1 offset = 02h) [reset = 3Ch]
      4. 8.6.4  Device Configuration-1 Register (Scratchpad-1 offset = 04h) [reset = 70h]
      5. 8.6.5  Device Configuration-2 Register (Scratchpad-1 offset = 05h) [reset = 80h]
      6. 8.6.6  Short Address Register (Scratchpad-1 offset = 06h) [reset = 00h]
      7. 8.6.7  Temperature Alert Low LSB Register (Scratchpad-1 offset = 08h) [reset = 00h]
      8. 8.6.8  Temperature Alert Low MSB Register (Scratchpad-1 offset = 09h) [reset = 00h]
      9. 8.6.9  Temperature Alert High LSB Register (Scratchpad-1 offset = 0Ah) [reset = F0h]
      10. 8.6.10 Temperature Alert High MSB Register (Scratchpad-1 offset = 0Bh) [reset = 07h]
      11. 8.6.11 Temperature Offset LSB Register (Scratchpad-1 offset = 0Ch) [reset = 00h]
      12. 8.6.12 Temperature Offset MSB Register (Scratchpad-1 offset = 0Dh) [reset = 00h]
      13. 8.6.13 IO Read Register [reset = F0h]
      14. 8.6.14 IO Configuration Register [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Bus Powered Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Supply Powered Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 UART Interface for Communication
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Single-wire interface with multi-drop shared bus and CRC
  • Bus powered with operating voltage from 1.7 V to 5.5 V
  • IEC 61000-4-2 ESD for 8-kV contact discharge
  • High-accuracy digital temperature sensor:
    • ±0.1°C (typical)/±0.3°C (maximum) from –20°C to +85°C
    • ±0.3°C (typical)/±0.5°C (maximum) from –55°C to +125°C
    • ±0.5°C (typical)/±1.0°C (maximum) from –55°C to +150°C
  • Active current of 100-µA (typical) and shutdown current of 1.0 µA (typical)
  • 16-bit temperature resolution: 7.8125 m°C (1 LSB)
  • Fast data rates of 90 kbps in overdrive speed
  • Flexible user programmable short address modes for faster device address
  • SHA-256-HMAC authentication scheme
    • FIPS 180-4 compliant Secure Hash Implementation
    • FIPS 198-1 compliant HMAC Implementation
  • 2-kbit EEPROM features:
    • Write operation in block size of 64-bits
    • Continuous read mode
    • Read with write protection with page size of 256-bits
    • Authenticated write protection mode with page size of 256-bits
    • Read/write current of 95 µA/178 µA (typical)
  • NIST traceable factory-programmed non erasable 64-bit identification number for device addressing
  • 4 configurable open-drain digital input-output and temperature alert