Home Wireless connectivity Wi-Fi products
Home
Wireless connectivity
Wi-Fi products

CC2560B

ACTIVE

Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)

Order now
Data sheet

A newer version of this product is available

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
CC2564C ACTIVE Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) Better performance and certification

CC2560B

ACTIVE
Data sheet Order now

Product details

Security Networking Security Operating temperature range (°C) -40 to 85 Rating Catalog
Security Networking Security Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFV) 54 9.550125 mm² 3.265 x 2.925 VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules
  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.
open-in-new Find other Wi-Fi products
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 3
Type Title Date
* Data sheet CC256x Dual-Mode Bluetooth Controller datasheet (Rev. E) PDF | HTML 12 Mar 2014
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 May 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

IDE, configuration, compiler or debugger

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

Supported products & hardware

Supported products & hardware

This design resource supports most products in these categories.

Check the product details page to verify support.
Launch Download options
Package Pins Download
DSBGA (YFV) 54 View options
VQFNP-MR (RVM) 76 View options
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos