CC2564C
Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)
CC2564C
- TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
- Bluetooth 5.1 Delaration ID D049226
- Highly Optimized for Size-Constrained and Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
- Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- Low Energy Features Include:
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
- Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
- Network Support for up to 10 Devices
- Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1 TX Power up to +12 dBm
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
- HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:
Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
CC256XCQFN-EM — CC2564C Dual-Mode Bluetooth® Controller Evaluation Module
CC2564CMSP432BTBLESW — CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs
CC2564CSTBTBLESW — CC2564C TI Dual-mode Bluetooth® Stack on STM32F4 MCUs
CC256XC-BT-SP — Bluetooth® Service Pack for CC256xC
In addition, the Bluetooth Service Pack also contains companion files for the CC2564C device that are useful for testing and debugging. The (...)
TI-BT-4-2-STACK-LINUX-ADDON — TI Bluetooth 4.2 Stack Add-On for Linux Platforms With WL183x and CC2564C
CC256X-CERTIFICATION — Radio certification for Dual Mode Bluetooth
DUALMODE-BT-DESIGN-REVIEWS — Hardware design reviews for CC256x devices
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
- Step 2: (...)
| Package | Pins | Download |
|---|---|---|
| VQFNP-MR (RVM) | 76 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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