Product details

Protocols Dual-mode Bluetooth Type Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Rating Catalog Security Networking security Sensitivity (best) (dBm) -95 Operating temperature range (C) -40 to 85
Protocols Dual-mode Bluetooth Type Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Rating Catalog Security Networking security Sensitivity (best) (dBm) -95 Operating temperature range (C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² 8 x 8
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

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Technical documentation

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Type Title Date
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 02 Dec 2020
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 May 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mar 2022
Selection guide 無線連線技術選擇指南 (Rev. B) 07 Mar 2022
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 07 Mar 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 Feb 2022
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 20 Dec 2021
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 20 Dec 2021
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 02 Dec 2021
User guide CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 01 Dec 2021
Application note TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 01 Dec 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 Dec 2020
Application note Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 17 Jul 2020
Application note Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 May 2020
Application note Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
Application note QFN and SON PCB Attachment (Rev. B) PDF | HTML 24 Aug 2018
Technical article An out-of-the-box Internet of Things: building a seamless and secure smart home network 12 Jun 2018
Technical article Thread vs. Zigbee – what’s the difference? 16 May 2018
Technical article Your microcontroller deserves a nap – designing “sleepy” wireless applications 28 Mar 2018
White paper Which TI Bluetooth® solution should I choose? 05 May 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 May 2017
Technical article SimpleLink™ MCU SDKs: Breaking down TI Drivers 12 Apr 2017
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 01 Nov 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

CC256XCQFN-EM — CC2564C Dual-Mode Bluetooth® Controller Evaluation Module

The TI CC256xC Bluetooth® device is a complete basic rate (BR), enhanced data rate (EDR), and LE host controller interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, the module is a product-proven solution supporting (...)
User guide: PDF | HTML
Not available on TI.com
Certification

CC256X-REPORTS Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Supported products & hardware

Supported products & hardware

Products
Bluetooth products
CC2564 Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT CC2564C Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) CC2564MODA Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna CC2564MODN Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
Hardware development
BOOST-CC2564MODA TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module CC2564MODAEM Dual-mode Bluetooth® CC2564 Module with Integrated Antenna Evaluation Board CC2564MODNEM Dual-mode Bluetooth® CC2564 module evaluation board CC256XCQFN-EM CC2564C Dual-Mode Bluetooth® Controller Evaluation Module CC256XQFNEM Dual-mode Bluetooth® CC2564 evaluation board
Download options
Driver or library

CC2564CMSP432BTBLESW — CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs

TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and QDID172097), (...)
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Driver or library

CC2564CSTBTBLESW — CC2564C TI Dual-mode Bluetooth® Stack on STM32F4 MCUs

TI’s CC2564C Dual-mode Bluetooth® stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 5.1 specification. The Bluetooth stack is fully qualified (QDID172096 and (...)
lock = Requires export approval (1 minute)
Driver or library

CC256XC-BT-SP — Bluetooth® Service Pack for CC256xC

The CC256xC Bluetooth Service Pack (SP) contains the mandatory initialization scripts (BTS files) that have platform specific configurations and bug fixes.

In addition, the Bluetooth Service Pack also contains companion files for the CC2564C device that are useful for testing and debugging. The (...)

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Driver or library

TI-BT-4-2-STACK-LINUX-ADDON — TI Bluetooth 4.2 Stack Add-On for Linux Platforms With WL183x and CC2564C

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
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Design tool

DUALMODE-BT-DESIGN-REVIEWS — Hardware design reviews for CC256x devices

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
User guide: PDF
Gerber file

CC256XCQFN-EM Design Files

SWRC329.ZIP (1375 KB)
Certification

CC256X-CERTIFICATION — Radio certification for Dual Mode Bluetooth

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
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VQFNP-MR (RVM) 76 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
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  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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Support & training

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