Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE)


Product details


Protocols Dual-mode Bluetooth Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power, LE Link Layer Topology, LE Secure Connections Type Transceiver Security Networking security Sensitivity (best) (dBm) -95 Operating temperature range (C) -40 to 85 Rating Catalog open-in-new Find other Bluetooth products

Package | Pins | Size

VQFNP-MR (RVM) 76 64 mm² 8 x 8 open-in-new Find other Bluetooth products


  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
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The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services


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Technical documentation

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Type Title Date
* Data sheet CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) Dec. 02, 2020
Technical article Wireless M-Bus 101: Demystifying modes and regional application profiles Jul. 02, 2021
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. A) Jun. 14, 2021
Selection guide 無線連線技術選擇指南 (Rev. A) Jun. 14, 2021
Selection guide 무선 연결 기술 선택 가이드 (Rev. A) Jun. 14, 2021
Selection guide Wireless Connectivity Technology Selection Guide (Rev. A) May 27, 2021
User guide Bluetopia Stack Build Guide for Linux Jan. 15, 2021
User guide CC2564x Demo Applications User's Guide Dec. 17, 2020
Application note Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) Jul. 17, 2020
Selection guide CC256x Getting Started Guide (Rev. B) Jun. 26, 2020
Application note Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) May 18, 2020
Application note Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V May 18, 2020
More literature Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. B) Mar. 11, 2020
User guide CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. A) Aug. 30, 2019
Technical article Bluetooth® Low Energy shifts gears for car access Jul. 15, 2019
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs Jan. 07, 2019
User guide CC2564B to CC2564C Migration Guide (Rev. A) Oct. 31, 2018
Application note QFN and SON PCB Attachment (Rev. B) Aug. 24, 2018
Technical article An out-of-the-box Internet of Things: building a seamless and secure smart home network Jun. 12, 2018
Technical article Thread vs. Zigbee – what’s the difference? May 16, 2018
More literature TI Bluetooth CC2564C Solution (Rev. A) May 11, 2017
White paper Which TI Bluetooth® solution should I choose? May 05, 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? May 04, 2017
User guide CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. A) Feb. 28, 2017
Application note Application Notes for CC2564C Bluetooth® 4.1 and 4.2 Nov. 01, 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide
The TI CC256xC Bluetooth® device is a complete basic rate (BR), enhanced data rate (EDR), and LE host controller interface (HCI) solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, the module is a product-proven solution supporting (...)
  • Supports Bluetooth 4.1/4.2
  • Compatible with standard TI interfaces, allowing development on a number of different platforms
  • On-board PCB antenna with option for U.FL-based testing
  • Supports easy development on COMM8 platforms
  • Operates from alkaline batteries for lower power designs

Software development

CC2564C TI Dual-mode Bluetooth® Stack on MSP432 MCUs
CC2564CMSP432BTBLESW — TI’s CC2564C Dual-mode Bluetooth® stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.2 specification. The Bluetooth stack is fully qualified (QDID 85355 and QDID (...)
  • Supports Dual-mode Bluetooth 4.2 - Bluetooth certified and royalty free
  • Supports LE Secure Connection
  • Supports LE Dual Mode Topology and Link Layer Topology with CC2564C
  • Bluetooth stack is fully qualified (QDID 85355 and QDID 69886)
  • Fully Thread safe
  • Sample apps are available for the MSP-EXP432P401R (...)
CC2564C TI Dual-mode Bluetooth® Stack on STM32F4 MCUs
CC2564CSTBTBLESW — TI’s CC2564C Dual-mode Bluetooth® stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.2 specification. The Bluetooth stack is fully qualified (QDID 85355 (...)
  • Supports Dual-mode Bluetooth 4.2 - Bluetooth certified and royalty free
  • Bluetooth stack is fully qualified (QDID 85355 and QDID 69886)
  • Fully Thread safe
  • Supports threaded (RTOS) and non-threaded (No OS) environment
  • Works with any STM32F4 MCU
  • Fully Documented API Interface
  • Sample Apps are available for (...)
Bluetooth® Service Pack for CC256xC
CC256XC-BT-SP The CC256xC Bluetooth Service Pack (SP) contains the mandatory initialization scripts (BTS files) that have platform specific configurations and bug fixes.

In addition, the Bluetooth Service Pack also contains companion files for the CC2564C device that are useful for testing and debugging. The (...)

  • Classic Bluetooth and Bluetooth Low Energy
  • Sleep Enabled
TI Bluetooth 4.2 Stack Add-On for Linux Platforms With WL183x and CC2564C
TI-BT-4-2-STACK-LINUX-ADDON This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
  • Dual mode Classic Bluetooth (BR/EDR) and Bluetooth Low Energy (BLE) Stack
    • Bluetooth Core Specification v4.2
  • Platform Manager Framework to enable multiple client applications to use the stack.
  • User space applications and stack that do not require specific kernel modules.
  • Compiled with Linaro GCC 4.7 (...)

Design tools & simulation

Hardware design reviews for CC256x devices
DUALMODE-BT-DESIGN-REVIEWS To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2 (...)
document-generic User guide
SWRC329.ZIP (1375 KB)
Radio certification for Dual Mode Bluetooth
CC256X-CERTIFICATION — Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
  • The CC256X-REPORTS link provides access to Dual mode BTcertification reports for:
    • CC256x modules
    • CC256x Evaluation boards (note: reports for evaluation boards are for reference only)
  • The CC256X-REQUEST link provides:
    • A TI letter of authorization for FCC and ISED when requested by the customer's regulatory (...)

CAD/CAE symbols

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Ordering & quality

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  • MSL rating/Peak reflow
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  • Ongoing reliability monitoring

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Support & training

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