CC2564C

• TI’s Single-Chip Bluetooth^® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
• Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer
• Highly Optimized for Size-Constrained and Low-Cost Designs:
  • Single-Ended 50-Ω RF Interface
  • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR)
• BR and EDR Features Include:
  • Up to Seven Active Devices
  • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
  • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
  • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
  • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
  • Support of Multiple Bluetooth Profiles With Enhanced QoS
• Low Energy Features Include:
  • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
  • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
  • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
  • Network Support for up to 10 Devices
  • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
  • Class 1 TX Power up to +12 dBm
  • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
  • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
  • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
• Advanced Power Management for Extended Battery Life and Ease of Design
  • On-Chip Power Management, Including Direct Connection to Battery
  • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
  • Shutdown and Sleep Modes to Minimize Power Consumption
• Physical Interfaces:
  • UART Interface With Support for Maximum Bluetooth Data Rates
    • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
    • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
  • Fully Programmable Digital Pulse-Code Modulation (PCM)–Inter-IC Sound (I2S) Codec Interface
• Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
• CC256x Bluetooth Hardware Evaluation Tool:
  PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

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The TI CC2564C device is a complete Bluetooth^® BR, EDR, and low energy HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 4.2 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with about twice the range of other Bluetooth low-energy solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod^® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications are supported including the following:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services