Top

Product details

Parameters

Technology Family AHC Number of channels (#) 1 Operating temperature range (C) -55 to 125 Rating Military ICC (Max) (uA) 40 open-in-new Find other Digital demultiplexers & decoders

Package | Pins | Size

CDIP (J) 16 135 mm² 19.65 x 6.92 CFP (W) 16 69 mm² 10 x 6.7 LCCC (FK) 20 79 mm² 8.89 x 8.89 open-in-new Find other Digital demultiplexers & decoders

Features

  • Operating Range 2-V to 5.5-V VCC
  • Designed Specifically for High-Speed Memory Decoders and Data-Transmission Systems
  • Incorporate Three Enable Inputs to Simplify Cascading and/or Data Reception
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

open-in-new Find other Digital demultiplexers & decoders

Description

The ’AHC138 decoders/demultiplexers are designed for high-performance memory-decoding and data-routing applications that require very short propagation-delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.

The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Two active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications.

open-in-new Find other Digital demultiplexers & decoders
Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 22
Type Title Date
* Data sheet SN54AHC138, SN74AHC138 datasheet (Rev. L) Jul. 02, 2003
* SMD SN54AHC138 SMD 5962-98516 Jun. 21, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) Dec. 02, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) Feb. 24, 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) Sep. 08, 1999
More literature Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) Apr. 01, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Live Insertion Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

CAD/CAE symbols

Package Pins Download
CDIP (J) 16 View options
CFP (W) 16 View options
LCCC (FK) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos