LinCMOS is a trademark of Texas Instruments Incorporated.
The TLV232x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. This amplifier is especially well suited to ultra-low-power systems that require devices to consume the absolute minimum of supply currents. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail.
These amplifiers are specifically targeted for use in very low-power, portable, battery-driven applications with the maximum supply current per operational amplifier specified at only 27 uA over its full temperature range of -40°C to 85°C.
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.
To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD can result in the degradation of the device parametric performance.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | Low-Voltage Low-Power Op Amp datasheet | 01 Feb 1997 | |
| Technical article | What is an op amp? | 21 Jan 2020 | ||
| Technical article | How to lay out a PCB for high-performance, low-side current-sensing designs | 06 Feb 2018 | ||
| Technical article | Low-side current sensing for high-performance cost-sensitive applications | 22 Jan 2018 | ||
| Technical article | Voltage and current sensing in HEV/EV applications | 22 Nov 2017 | ||
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 Mar 2017 | ||
| Application note | TLV2322, TLV2324 EMI Immunity Performance | 20 Dec 2012 |
For additional terms or required resources, click any title below to view the detail page where available.
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The DUAL-DIYAMP-EVM is an evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling quick evaluation of design concepts and verify simulations. It is designed specifically for dual package op amps in the (...)
| Package | Pins | Download |
|---|---|---|
| PDIP (P) | 8 | View options |
| SOIC (D) | 8 | View options |
| TSSOP (PW) | 8 | View options |
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