Dual Low-Voltage Low-Power Operational Amplifier
Product details
Parameters
Package | Pins | Size
Features
- Wide Range of Supply Voltages Over Specified Temperature Range:
- TA = -40°C to 85°C...2 V to 8 V
- Fully Characterized at 3 V and 5 V
- Single-Supply Operation
- Common-Mode Input-Voltage Range
Extends Below the Negative Rail and up to
VDD -1 V at TA = 25°C - Output Voltage Range Includes Negative Rail
- High Input Impedance...1012
Typ
- ESD-Protection Circuitry
- Designed-In Latch-Up Immunity
LinCMOS is a trademark of Texas Instruments Incorporated.
Description
The TLV233x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike the TLV2322 which is optimized for ultra-low power, the TLV233x is designed to provide a combination of low power and good ac performance. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input-voltage range includes the negative rail and extends to within 1 V of the positive rail.
Having a maximum supply current of only 310 uA per amplifier over full temperature range, the TLV233x devices offer a combination of good ac performance and microampere supply currents. From a 3-V power supply, the amplifier's typical slew rate is 0.38 V/us and its bandwidth is 300 kHz.
These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications.
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOSTM technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.
To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | LinCMOS Low-Voltage Medium-Power Operational Amplifiers datasheet | Feb. 01, 1997 |
Technical articles | What is an op amp? | Jan. 21, 2020 | |
Technical articles | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
Technical articles | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
Technical articles | Voltage and current sensing in HEV/EV applications | Nov. 22, 2017 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
Description
Features
- 10 circuit configurations to choose from: Non-Inverting, Inverting, Active Filters, Difference Amplifier with Reference Buffer, and more!
- Multiple interface options: SMA, Header, Breadboard, Wire
- Designed for 0805 size components; 0603 size friendly
- Circuit schematic provided in silkscreen on the back (...)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
PDIP (P) | 8 | View options |
SOIC (D) | 8 | View options |
TSSOP (PW) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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