Stereo audio DAC with stereo 125-mW headphone driver & audio processing
Product details
Parameters
Package | Pins | Size
Features
- Stereo Audio DAC with 100dB SNR
- 4.1mW Stereo 48ksps Playback
- PowerTune™
- Extensive Signal Processing Options
- Stereo Headphone Outputs
- Low Power Analog Bypass Mode
- Programmable PLL
- Integrated LDO
- 4 mm × 4 mm VQFN and 2.7 mm × 2.7 mm DSGBA Package
Description
The TLV320DAC3203 (sometimes referred to as the DAC3203) is a flexible, low-power, low-voltage stereo audio codec with programmable outputs, PowerTune capabilities, fixed predefined and parameterizable signal processing blocks, integrated PLL, integrated LDO and flexible digital interfaces. Extensive register-based control of power, input/output channel configuration, gains, effects, pin-multiplexing and clocks is included, allowing the device to be precisely targeted to its application.
The device is available in the 4 mm × 4 mm VQFN and 2.7 mm × 2.7 mm DSGBA package.
Similar functionality to the compared device.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TLV320DAC3203 Ultra Low Power Stereo Audio Codec With Integrated Headphone Ampli datasheet (Rev. B) | Dec. 17, 2018 |
| Application note | PLL and Clocking Configuration for Audio Devices | Mar. 26, 2019 | |
| User guide | TLV320DAC3203 Application Ref Guide (Rev. A) | Feb. 08, 2019 | |
| User guide | TLV320DAC3203EVM-K User's Guide | Apr. 18, 2012 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The TLV320DAC3203EVM-K is a complete evaluation/demonstration kit for the TLV320DAC3203 audio DAC. The kit includes a TLV320DAC3203EVM, and a USB-based motherboard called the USB-MODEVM Interface board. The TLV320DAC3203EVM-K software, the DAC3203 CS, is an intuitive, easy-to-use, powerful tool to (...)
Features
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| DSBGA (YZK) | 25 | View options |
| VQFN (RGE) | 24 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.