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  • High-Performance Static CMOS Technology
  • TMS470R1x 16/32-Bit RISC Core (ARM7TDM™)
    • 60-MHz (Pipeline Mode)
    • Independent 16/32-Bit Instruction Set
    • Open Architecture With Third-Party Support
    • Built-In Debug Module
    • Utilizes Big-Endian Format
  • Integrated Memory
    • 768K-Byte Program Flash
      • Banks With 18 Contiguous Sectors
      • Internal State Machine for Programming and Erase
    • 48K-Byte Static RAM (SRAM)
  • 15 Dedicated GIO Pins, 1 Input-Only GIO Pin, and 71 Additional Peripheral I/Os
  • Operating Features
    • Core Supply Voltage (VCC): 1.81–2.05 V
    • I/O Supply Voltage (VCCIO): 3.0–3.6 V
    • Low-Power Modes: STANDBY and HALT
    • Extended Industrial Temperature Range
  • 470+ System Module
    • 32-Bit Address Space Decoding
    • Bus Supervision for Memory and Peripherals
    • Analog Watchdog (AWD) Timer
    • Real-Time Interrupt (RTI)
    • System Integrity and Failure Detection
    • Interrupt Expansion Module (IEM)
  • Direct Memory Access (DMA) Controller
    • 32 Control Packets and 16 Channels
  • Zero-Pin Phase-Locked Loop (ZPLL)-Based Clock Module With Prescaler
    • Multiply-by-4 or -8 Internal ZPLL Option
    • ZPLL Bypass Mode
  • Ten Communication Interfaces:
    • Five Serial Peripheral Interfaces (SPIs)
      • 255 Programmable Baud Rates
    • Two Serial Communications Interfaces (SCIs)
      • 224 Selectable Baud Rates
      • Asynchronous/Isosynchronous Modes
    • Three High-End CAN Controllers (HECCs)
      • 32-Mailbox Capacity Each
      • Fully Compliant With CAN Protocol, Version 2.0B
  • High-End Timer (HET)
    • 32 Programmable I/O Channels:
      • 24 High-Resolution Pins
      • 8 Standard-Resolution Pins
    • High-Resolution Share Feature (XOR)
    • High-End Timer RAM
      • 128-Instruction Capacity
  • 16-Channel 10-Bit Multi-Buffered ADC (MibADC)
    • 256-Word FIFO Buffer
    • Single- or Continuous-Conversion Modes
    • 1.55-µs Minimum Sample and Conversion Time
    • Calibration Mode and Self-Test Features
  • Eight External Interrupts
  • Flexible Interrupt Handling
  • External Clock Prescale (ECP) Module
    • Programmable Low-Frequency External Clock (CLK)
  • On-Chip Scan-Base Emulation Logic, IEEE Standard 1149.1(1) (JTAG) Test-Access Port
  • 144-Pin Plastic Low-Profile Quad Flatpack (PGE Suffix)

(1) The test-access port is compatible with the IEEE Standard 1149.1-1990, IEEE Standard Test-Access Port and Boundary Scan Architecture specification. Boundary scan is not supported on this device.
(2) Throughout the remainder of this document, TMS470R1B768 shall be referred to as either the full device name or B768.
ARM7TDM is a trademark of Advanced RISC Machines Limited (ARM).
All other trademarks are the property of their respective owners.

  • High-Performance Static CMOS Technology
  • TMS470R1x 16/32-Bit RISC Core (ARM7TDM™)
    • 60-MHz (Pipeline Mode)
    • Independent 16/32-Bit Instruction Set
    • Open Architecture With Third-Party Support
    • Built-In Debug Module
    • Utilizes Big-Endian Format
  • Integrated Memory
    • 768K-Byte Program Flash
      • Banks With 18 Contiguous Sectors
      • Internal State Machine for Programming and Erase
    • 48K-Byte Static RAM (SRAM)
  • 15 Dedicated GIO Pins, 1 Input-Only GIO Pin, and 71 Additional Peripheral I/Os
  • Operating Features
    • Core Supply Voltage (VCC): 1.81–2.05 V
    • I/O Supply Voltage (VCCIO): 3.0–3.6 V
    • Low-Power Modes: STANDBY and HALT
    • Extended Industrial Temperature Range
  • 470+ System Module
    • 32-Bit Address Space Decoding
    • Bus Supervision for Memory and Peripherals
    • Analog Watchdog (AWD) Timer
    • Real-Time Interrupt (RTI)
    • System Integrity and Failure Detection
    • Interrupt Expansion Module (IEM)
  • Direct Memory Access (DMA) Controller
    • 32 Control Packets and 16 Channels
  • Zero-Pin Phase-Locked Loop (ZPLL)-Based Clock Module With Prescaler
    • Multiply-by-4 or -8 Internal ZPLL Option
    • ZPLL Bypass Mode
  • Ten Communication Interfaces:
    • Five Serial Peripheral Interfaces (SPIs)
      • 255 Programmable Baud Rates
    • Two Serial Communications Interfaces (SCIs)
      • 224 Selectable Baud Rates
      • Asynchronous/Isosynchronous Modes
    • Three High-End CAN Controllers (HECCs)
      • 32-Mailbox Capacity Each
      • Fully Compliant With CAN Protocol, Version 2.0B
  • High-End Timer (HET)
    • 32 Programmable I/O Channels:
      • 24 High-Resolution Pins
      • 8 Standard-Resolution Pins
    • High-Resolution Share Feature (XOR)
    • High-End Timer RAM
      • 128-Instruction Capacity
  • 16-Channel 10-Bit Multi-Buffered ADC (MibADC)
    • 256-Word FIFO Buffer
    • Single- or Continuous-Conversion Modes
    • 1.55-µs Minimum Sample and Conversion Time
    • Calibration Mode and Self-Test Features
  • Eight External Interrupts
  • Flexible Interrupt Handling
  • External Clock Prescale (ECP) Module
    • Programmable Low-Frequency External Clock (CLK)
  • On-Chip Scan-Base Emulation Logic, IEEE Standard 1149.1(1) (JTAG) Test-Access Port
  • 144-Pin Plastic Low-Profile Quad Flatpack (PGE Suffix)

(1) The test-access port is compatible with the IEEE Standard 1149.1-1990, IEEE Standard Test-Access Port and Boundary Scan Architecture specification. Boundary scan is not supported on this device.
(2) Throughout the remainder of this document, TMS470R1B768 shall be referred to as either the full device name or B768.
ARM7TDM is a trademark of Advanced RISC Machines Limited (ARM).
All other trademarks are the property of their respective owners.

The TMS470R1B768(2) device is a member of the Texas Instruments (TI) TMS470R1x family of general-purpose 16/32-bit reduced instruction set computer (RISC) microcontrollers. The B768 microcontroller offers high performance utilizing the high-speed ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The TMS470R1B768 utilizes the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The B768 RISC core architecture offers solutions to these performance and cost demands while maintaining low power consumption.

The B768 device contains the following:

  • ARM7TDMI 16/32-Bit RISC CPU
  • TMS470R1x system module (SYS) with 470+ enhancements [including an interrupt expansion module (IEM) and a 16-channel direct-memory access (DMA) controller]
  • 768K-byte flash
  • 48K-byte SRAM
  • Zero-pin phase-locked loop (ZPLL) clock module
  • Analog watchdog (AWD) timer
  • Real-time interrupt (RTI) module
  • Five serial peripheral interface (SPI) modules
  • Two serial communications interface (SCI) modules
  • Three high-end CAN controller (HECC) modules
  • 10-bit multi-buffered analog-to-digital converter (MibADC) with 16 input channels
  • High-end timer (HET) controlling 32 I/Os
  • External clock prescale (ECP) module
  • Up to 86 I/O pins and 1 input-only pin

The functions performed by the 470+ system module (SYS) include:

  • Address decoding
  • Memory protection
  • Memory and peripherals bus supervision
  • Reset and abort exception management
  • Expanded interrupt capability with prioritization for all internal interrupt sources
  • Device clock control
  • Direct-memory access (DMA) and control
  • Parallel signature analysis (PSA)

This data sheet includes device-specific information such as memory and peripheral select assignment, interrupt priority, and a device memory map. For a more detailed functional description of the SYS module, see the TMS470R1x System Module Reference Guide (literature number SPNU189). For a more detailed functional description of the IEM module, see the TMS470R1x Interrupt Expansion Module (IEM) Reference Guide (literature number SPNU211). And for a more detailed functional description of the DMA module, see the TMS470R1x Direct-Memory Access (DMA) Controller Reference Guide (literature number SPNU210).

The B768 memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes.

The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 32-bit-wide data bus interface. The flash operates with a system clock frequency of up to 24 MHz. When in pipeline mode, the flash operates with a system clock frequency of up to 60 MHz. For more detailed information on the F05 devices flash, see the F05 flash section of this data sheet.

The B768 device has ten communication interfaces: five SPIs, two SCIs, and three HECCs. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The SCI is a full-duplex, serial I/O interface intended for asynchronous communication between the CPU and other peripherals using the standard non-return-to-zero (NRZ) format. The HECC uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The HECC is ideal for applications operating in noisy and harsh environments (e.g., industrial fields) that require reliable serial communication or multiplexed wiring. For more detailed functional information on the SPI, SCI, and HECC, see the specific reference guides for these modules (literature numbers SPNU195, SPNU196, and SPNU197, respectively).

The HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. For more detailed functional information on the HET, see the TMS470R1x High-End Timer (HET) Reference Guide (literature number SPNU199).

The B768 HET peripheral contains the XOR-share feature. This feature allows two adjacent HET high-resolution channels to be XORed together, making it possible to output smaller pulses than a standard HET. For more detailed information on the HET XOR-share feature, see the TMS470R1x High-End Timer (HET) Reference Guide (literature number SPNU199).

The B768 device has a 10-bit-resolution, 16-channel sample-and-hold MibADC. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. There are three separate groupings, two of which are triggerable by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode. For more detailed functional information on the MibADC, see the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide (literature number SPNU206).

The zero-pin phase-locked loop (ZPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler (with prescale values of 1–8). The function of the ZPLL is to multiply the external frequency reference to a higher frequency for internal use. The ZPLL provides ACLK to the system (SYS) module. The SYS module subsequently provides system clock (SYSCLK), real-time interrupt clock (RTICLK), CPU clock (MCLK), and peripheral interface clock (ICLK) to all other B768 device modules. For more detailed functional information on the ZPLL, see the TMS470R1x Zero-Pin Phase-Locked Loop (ZPLL) Clock Module Reference Guide (literature number SPNU212).

NOTE: ACLK should not be confused with the MibADC internal clock, ADCLK. ACLK is the continuous system clock from an external resonator/crystal reference.

The B768 device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock (ECLK) on a specified GIO pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (ICLK) frequency. For more detailed functional information on the ECP, see the TMS470R1x External Clock Prescaler (ECP) Reference Guide (literature number SPNU202).

The TMS470R1B768(2) device is a member of the Texas Instruments (TI) TMS470R1x family of general-purpose 16/32-bit reduced instruction set computer (RISC) microcontrollers. The B768 microcontroller offers high performance utilizing the high-speed ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The TMS470R1B768 utilizes the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.

High-end embedded control applications demand more performance from their controllers while maintaining low costs. The B768 RISC core architecture offers solutions to these performance and cost demands while maintaining low power consumption.

The B768 device contains the following:

  • ARM7TDMI 16/32-Bit RISC CPU
  • TMS470R1x system module (SYS) with 470+ enhancements [including an interrupt expansion module (IEM) and a 16-channel direct-memory access (DMA) controller]
  • 768K-byte flash
  • 48K-byte SRAM
  • Zero-pin phase-locked loop (ZPLL) clock module
  • Analog watchdog (AWD) timer
  • Real-time interrupt (RTI) module
  • Five serial peripheral interface (SPI) modules
  • Two serial communications interface (SCI) modules
  • Three high-end CAN controller (HECC) modules
  • 10-bit multi-buffered analog-to-digital converter (MibADC) with 16 input channels
  • High-end timer (HET) controlling 32 I/Os
  • External clock prescale (ECP) module
  • Up to 86 I/O pins and 1 input-only pin

The functions performed by the 470+ system module (SYS) include:

  • Address decoding
  • Memory protection
  • Memory and peripherals bus supervision
  • Reset and abort exception management
  • Expanded interrupt capability with prioritization for all internal interrupt sources
  • Device clock control
  • Direct-memory access (DMA) and control
  • Parallel signature analysis (PSA)

This data sheet includes device-specific information such as memory and peripheral select assignment, interrupt priority, and a device memory map. For a more detailed functional description of the SYS module, see the TMS470R1x System Module Reference Guide (literature number SPNU189). For a more detailed functional description of the IEM module, see the TMS470R1x Interrupt Expansion Module (IEM) Reference Guide (literature number SPNU211). And for a more detailed functional description of the DMA module, see the TMS470R1x Direct-Memory Access (DMA) Controller Reference Guide (literature number SPNU210).

The B768 memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes.

The flash memory on this device is a nonvolatile, electrically erasable and programmable memory implemented with a 32-bit-wide data bus interface. The flash operates with a system clock frequency of up to 24 MHz. When in pipeline mode, the flash operates with a system clock frequency of up to 60 MHz. For more detailed information on the F05 devices flash, see the F05 flash section of this data sheet.

The B768 device has ten communication interfaces: five SPIs, two SCIs, and three HECCs. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The SCI is a full-duplex, serial I/O interface intended for asynchronous communication between the CPU and other peripherals using the standard non-return-to-zero (NRZ) format. The HECC uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 megabit per second (Mbps). The HECC is ideal for applications operating in noisy and harsh environments (e.g., industrial fields) that require reliable serial communication or multiplexed wiring. For more detailed functional information on the SPI, SCI, and HECC, see the specific reference guides for these modules (literature numbers SPNU195, SPNU196, and SPNU197, respectively).

The HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. For more detailed functional information on the HET, see the TMS470R1x High-End Timer (HET) Reference Guide (literature number SPNU199).

The B768 HET peripheral contains the XOR-share feature. This feature allows two adjacent HET high-resolution channels to be XORed together, making it possible to output smaller pulses than a standard HET. For more detailed information on the HET XOR-share feature, see the TMS470R1x High-End Timer (HET) Reference Guide (literature number SPNU199).

The B768 device has a 10-bit-resolution, 16-channel sample-and-hold MibADC. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. There are three separate groupings, two of which are triggerable by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode. For more detailed functional information on the MibADC, see the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide (literature number SPNU206).

The zero-pin phase-locked loop (ZPLL) clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler (with prescale values of 1–8). The function of the ZPLL is to multiply the external frequency reference to a higher frequency for internal use. The ZPLL provides ACLK to the system (SYS) module. The SYS module subsequently provides system clock (SYSCLK), real-time interrupt clock (RTICLK), CPU clock (MCLK), and peripheral interface clock (ICLK) to all other B768 device modules. For more detailed functional information on the ZPLL, see the TMS470R1x Zero-Pin Phase-Locked Loop (ZPLL) Clock Module Reference Guide (literature number SPNU212).

NOTE: ACLK should not be confused with the MibADC internal clock, ADCLK. ACLK is the continuous system clock from an external resonator/crystal reference.

The B768 device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock (ECLK) on a specified GIO pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (ICLK) frequency. For more detailed functional information on the ECP, see the TMS470R1x External Clock Prescaler (ECP) Reference Guide (literature number SPNU202).

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Technical documentation

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Type Title Date
* Data sheet TMS470R1B768 16/32-Bit RISC Flash Microcontroller datasheet (Rev. B) 21 May 2008
* Errata TMS470R1B768 TMS470 Microcontrollers Silicon Errata 30 Jun 2005
Technical article 5 ways high-performance MCUs are reshaping the industry 12 Jul 2021
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Y) PDF | HTML 04 Feb 2020
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. V) PDF | HTML 04 Feb 2020
User guide Hercules Diagnostic Library -TAU Installation Guide (Rev. B) PDF | HTML 08 Jan 2020
More literature SafeTI™ Hercules™ Diagnostic Library Release Notes (Rev. A) 24 Sep 2019
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 03 Jun 2019
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 03 Jun 2019
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 19 Nov 2018
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 19 Nov 2018
Application note Interfacing the Embedded 12-Bit ADC in a TMS570LS31x/21x and RM4x Series MCUs (Rev. A) 20 Apr 2018
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 16 Jan 2018
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 16 Jan 2018
Application note Sharing FEE Blocks Between the Bootloader and the Application 07 Nov 2017
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 30 Sep 2017
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 30 Sep 2017
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 21 Jun 2017
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 21 Jun 2017
Application note Sharing Exception Vectors on Hercules™ Based Microcontrollers 27 Mar 2017
Application note How to Create a HALCoGen Based Project For CCS (Rev. B) 09 Aug 2016
Application note Using the CRC Module on Hercules™-Based Microcontrollers 04 Aug 2016
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 30 Apr 2016
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 30 Apr 2016
Application note High Speed Serial Bus Using the MibSPIP Module on Hercules-Based MCUs 22 Apr 2016
Application note JTAG Programmer Overview for Hercules-Based Microcontrollers 18 Nov 2015
Application note Interfacing Quadrature Encoders Using the High-End Timer on Hercules MCUs 19 Oct 2015
White paper Extending TI’s Hercules MCUs with the integrated flexible HET 29 Sep 2015
White paper Foundational Software for Functional Safety 12 May 2015
Application note Triangle/Trapezoid Wave Generation Using PWM With Hercules N2HET 01 May 2015
Application note Nested Interrupts on Hercules ARM Cortex-R4/5-Based Microncontrollers 23 Apr 2015
Application note Interrupt and Exception Handling on Hercules ARM Cortex-R4/5-Based MCUs 20 Apr 2015
Application note Monitoring PWM Using N2HET 02 Apr 2015
Application note Hercules SCI With DMA 22 Mar 2015
Application note Limiting Clamp Currents on TMS470/TMS570 Digital and Analog Inputs (Rev. A) 08 Dec 2014
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 05 Nov 2014
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 05 Nov 2014
Application note Migrating from RM48x or RM46x to RM42x Safety MCUs (Rev. A) 22 Sep 2014
Application note Hercules TMS570LC/RM57Lx Safety MCUs Development Insights Using Debug and Trace 21 May 2014
Application note Migrating From RM48x to RM46x Safety MCUs (Rev. A) 19 Feb 2014
Application note Interfacing TPS65381 With Hercules Microcontrollers (Rev. A) 14 Feb 2014
User guide Trace Analyzer User's Guide (Rev. B) 18 Nov 2013
Application note CAN Bus Bootloader for RM42 MCU 16 Sep 2013
Application note CAN Bus Bootloader for RM46 MCU 16 Sep 2013
Application note CAN Bus Bootloader for RM48x MCU 16 Sep 2013
Application note SPI Bootloader for Hercules RM42 MCU 16 Sep 2013
Application note SPI Bootloader for Hercules RM46 MCU 16 Sep 2013
Application note SPI Bootloader for Hercules RM48 MCU 16 Sep 2013
Application note UART Bootloader for Hercules RM42 MCU 16 Sep 2013
Application note UART Bootloader for Hercules RM46 MCU 16 Sep 2013
Application note UART Bootloader for Hercules RM48 MCU 16 Sep 2013
Application note Initialization of Hercules ARM Cortex-R4F Microcontrollers (Rev. D) 29 May 2013
Application note Reduction of Power Consumption for RM48L950 (Rev. A) 30 Oct 2012
White paper Accelerating safety-certified motor control designs (Rev. A) 04 Oct 2012
Application note Initialization of the TMS570LS043x, 570LS033x & RM42L432 Hercules ARM Cortex-R4 26 Sep 2012
Application note Hercules Family Frequency Slewing to Reduce Voltage and Current Transients 05 Jul 2012
Application note Basic PBIST Configuration and Influence on Current Consumption (Rev. C) 12 Apr 2012
Application note Verification of Data Integrity Using CRC 17 Feb 2012
User guide HET Integrated Development Environment User's Guide (Rev. A) 17 Nov 2011
Application note Important ARM Ltd Application Notes for TI Hercules ARM Safety MCUs 17 Nov 2011
Application note Execution Time Measurement for Hercules ARM Safety MCUs (Rev. A) 04 Nov 2011
Application note Use of All 1'’s and All 0's Valid in Flash EEPROM Emulation 27 Sep 2011
Application note 3.3 V I/O Considerations for Hercules Safety MCUs (Rev. A) 06 Sep 2011
Application note ADC Source Impedance for Hercules ARM Safety MCUs (Rev. B) 06 Sep 2011
Application note Configuring a CAN Node on Hercules ARM Safety MCUs 06 Sep 2011
Application note Configuring the Hercules ARM Safety MCU SCI/LIN Module for UART Communication (Rev. A) 06 Sep 2011
Application note Leveraging the High-End Timer Transfer Unit on Hercules ARM Safety MCUs (Rev. A) 06 Sep 2011
White paper Hercules™ Microcontrollers: Real-time MCUs for safety-critical products 02 Sep 2011
Application note NHET Getting Started (Rev. B) 30 Aug 2010
Application note Generating Operating System Tick Using RTI on a Hercules ARM Safety MCU 13 Jul 2010
Application note Usage of MPU Subregions on TI Hercules ARM Safety MCUs 10 Mar 2010
User guide TI Assembly Language Tools Enhanced High-End Timer (NHET) Assembler User's Guide 04 Mar 2010
White paper Discriminating between Soft Errors and Hard Errors in RAM White Paper 04 Jun 2008
White paper Using DMA to Double System Performance - White Paper 19 Jan 2007
User guide TMS470R1x Inter-Integrated Circuit (I2C) Reference Guide (Rev. C) 11 Feb 2005

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Industrial mmWave radar sensors
IWR1443 Single-chip 76-GHz to 81-GHz mmWave sensor integrating MCU and hardware accelerator IWR1642 Single-chip 76-GHz to 81-GHz mmWave sensor integrating DSP and MCU IWR1843 Single-chip 76-GHz to 81-GHz industrial radar sensor integrating DSP, MCU and radar accelerator IWR6443 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating MCU and hardware accelerator IWR6843 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability IWR6843AOP Single-chip 60-GHz to 64-GHz intelligent mmWave sensor with integrated antenna on package (AoP)
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Simulation model

RM48Lx ZWT BSDL Model (Rev. A) RM48Lx ZWT BSDL Model (Rev. A)

Simulation model

RM48Lx PGE BSDL Model (Rev. A) RM48Lx PGE BSDL Model (Rev. A)

Simulation model

RM46Lx PGE BSDL Model RM46Lx PGE BSDL Model

Simulation model

RM46Lx ZWT BSDL Model RM46Lx ZWT BSDL Model

Simulation model

RM48x PGE IBIS Model (Silicon Revision B) RM48x PGE IBIS Model (Silicon Revision B)

Simulation model

RM48x PGE IBIS Model (Silicon Revision C) RM48x PGE IBIS Model (Silicon Revision C)

Simulation model

RM48x ZWT IBIS Model (Silicon Revision B) RM48x ZWT IBIS Model (Silicon Revision B)

Simulation model

RM48x ZWT IBIS Model (Silicon Revision C) RM48x ZWT IBIS Model (Silicon Revision C)

Simulation model

RM44Lx22 ZWT; RM44Lx20 PGE and PZ BSDL Model RM44Lx22 ZWT; RM44Lx20 PGE and PZ BSDL Model

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