Gehäuseinformationen
| Gehäuse | Pins BGA (NXA) | 292 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 40 | JEDEC TRAY (10+1) |
Merkmale von ADC12D1800RF
- Excellent Noise and Linearity Up to and Above fIN = 2.7 GHz
- Configurable to Either 3.6 GSPS Interleaved or 1800 MSPS Dual ADC
- New DESCLKIQ Mode for High Bandwidth, High Sampling Rate Apps
- Pin-Compatible with ADC1xD1x00, ADC12Dx00RF
- AutoSync Feature for Multi-Chip Synchronization
- Internally Terminated, Buffered, Differential Analog Inputs
- Interleaved Timing Automatic and Manual Skew Adjust
- Test Patterns at Output for System Debug
- Time Stamp Feature to Capture External Trigger
- Programmable Gain, Offset, and tAD Adjust
- 1:1 Non-Demuxed or 1:2 Demuxed LVDS Outputs
- Key Specifications
- Resolution: 12 Bits
- Interleaved 3.6 GSPS ADC (all typical)
- IMD3 (Fin = 2.7GHz at -13dBFS) –62 dBc
- IMD3 (Fin = 2.7GHz at -16dBFS) –64 dBc
- Noise Floor Density -155.0 dBm/Hz
- Power 4.29 W
- Dual 1800 MSPS ADC, Fin = 498 MHz
- ENOB 9.3 Bits (typ)
- SNR 58.1 dB (typ)
- SFDR 71.7 dBc (typ)
- Power per Channel 2.15 W (typ)
Beschreibung von ADC12D1800RF
The 12-bit 1.8 GSPS ADC12D1800RF is an RF-sampling GSPS ADC that can directly sample input frequencies up to and above 2.7 GHz. The ADC12D1800RF augments the very large Nyquist zone of TI’s GSPS ADCs with excellent noise and linearity performance at RF frequencies, extending its usable range beyond the 3rd Nyquist zone.
The ADC12D1800RF provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and supports programmable common mode voltage. The product is packaged in a lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of –40°C to +85°C.