Gehäuseinformationen
| Gehäuse | Pins HTSSOP (PWP) | 14 |
| Betriebstemperaturbereich (°C) -40 to 105 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von LM48100Q-Q1
- Output Fault Detection
- I2C Volume and Mode Control
- Input Mixer and Multiplexer
- High PSRR
- Individual 32-Step Volume Control
- Short Circuit and Thermal Protection
- Advanced Click-and-Pop Suppression
- Low-Power Shutdown Mode
- Available in 14-Pin HTSSOP Package
- Key Specifications:
- Output Power at VDD = 5 V, RL = 8 Ω,
THD+N ≤ 1% 1.3 W (Typical) - Quiescent Power Supply Current at 5 V,
6 mA (Typical) - PSRR at 1 kHz 74 dB (Typical)
- Shutdown current 0.01 µA (Typical)
- Output Power at VDD = 5 V, RL = 8 Ω,
Beschreibung von LM48100Q-Q1
The LM48100Q-Q1 is a single supply, mono, bridge-tied load amplifier with I2C volume control, ideal for automotive applications. A comprehensive output fault detection system senses the load conditions, protecting the device during short circuit events, as well as detecting open circuit conditions.
Operating from a single 5-V supply, the LM48100Q-Q1 delivers 1.3 W of continuous output power to an 8 Ω load with < 1% THD+N. Flexible power supply requirements allow operation from 3 V to 5.5 V. High power supply rejection ratio (PSRR), 74 dB at 1 kHz, allows the device to operate in noisy environments without additional power supply conditioning.
The LM48100Q-Q1 features dual audio inputs that can be mixed/multiplexed to the device output. Each input path has its own independent, 32-step volume control. The mixer, volume control and device mode select are controlled through an I2C compatible interface. An open drain FAULT output indicates when a fault has occurred. Comprehensive output short circuit and thermal overload protection prevent the device from being damaged during a fault condition.
A low power shutdown mode reduces supply current consumption to 0.01 µA. Superior click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM48100Q-Q1 is available in an 14-pin HTSSOP PowerPAD™ IC package.