The LMV1032s are an audio amplifier series for small form factor electret microphones.
They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for
extended battery life applications, such as a Bluetooth communication link. The addition of a third
pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in
supply current as compared to the JFET equipped electret microphone. Microphone supply current is
thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply
voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance over the voice bandwidth, excellent power
supply rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and
are thus ideally suited for the form factor of miniature electret microphone packages. These
extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is
designed for microphone PCBs requiring 1 kg adhesion criteria.
The LMV1032s are an audio amplifier series for small form factor electret microphones.
They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for
extended battery life applications, such as a Bluetooth communication link. The addition of a third
pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in
supply current as compared to the JFET equipped electret microphone. Microphone supply current is
thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply
voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.
The LMV1032 series offers low output impedance over the voice bandwidth, excellent power
supply rejection (PSRR), and stability over temperature.
The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and
are thus ideally suited for the form factor of miniature electret microphone packages. These
extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is
designed for microphone PCBs requiring 1 kg adhesion criteria.