Gehäuseinformationen
| Gehäuse | Pins DSBGA (YFP) | 8 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 3.000 | LARGE T&R |
Merkmale von SN74AUP3G07
- Available in the Texas Instruments NanoStar Package
- Low Static-Power Consumption
(ICC = 0.9 µA Maximum) - Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typ at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
Beschreibung von SN74AUP3G07
The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.
The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.