Gehäuseinformationen
| Gehäuse | Pins SOIC (D) | 8 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 2.500 | LARGE T&R |
Merkmale von TPA741
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V – 5.5 V
- Output Power for RL = 8
- 700 mW at VDD = 5 V
- 250 mW at VDD = 3.3 V
- SOIC
- PowerPAD™ MSOP
- Integrated Depop Circuitry
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
PowerPAD is a trademark of Texas Instruments.
Beschreibung von TPA741
The TPA741 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA741 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA741 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which reduces board space by 50% and height by 40%.