AM2732

ACTIVO

MCU basada en Arm® Cortex-R5F de doble núcleo con C66x DSP, Ethernet y seguridad de hasta 400 MHz

Detalles del producto

CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP, Radar Hardware Accelerator, Radar hardware accelerator Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Catalog Operating temperature range (°C) -40 to 105 Ethernet MAC only
NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. C) PDF | HTML 06 jun 2025
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 (Rev. C) PDF | HTML 14 may 2025
* User guide AM273x Technical Reference Manual (Rev. E) 10 abr 2025
Application brief AM273x QSPI Flash Selection Guide (Rev. A) PDF | HTML 07 abr 2025
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 28 ene 2025
Application note AM273x Hardware Design Guide (Rev. A) PDF | HTML 27 nov 2023
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 08 nov 2023
Application note Sitara MCU Thermal Design PDF | HTML 11 sep 2023
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 03 ago 2023
User guide 10-kW, Three-Phase, Three-Level (T-Type) Inverter Using AM263 PDF | HTML 11 jul 2023
Application note Debugging Sitara AM2x Microcontrollers PDF | HTML 24 oct 2022
Application note Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 08 ago 2022
More literature New Product Update: AM2732 17 mar 2022
Application note Power Estimation Tool PDF | HTML 01 dic 2021

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

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Guía del usuario: PDF | HTML
Placa de evaluación

TMDS273EVM — Módulo de evaluación AM273x para MCU basados en Arm

El módulo de evaluación (EVM) AM273x es una plataforma de prueba, desarrollo y evaluación independiente que permite a los desarrolladores evaluar la funcionalidad del AM273x y desarrollar prototipos para diversas aplicaciones.

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Sonda de depuración

TMDSEMU110-U — Sonda de depuración XDS110 JTAG

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No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

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All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Sonda de depuración

LB-3P-TRACE32-ARM — Sistema de depuración y seguimiento Lauterbach TRACE32 para microcontroladores y procesadores basado

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Sonda de depuración

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Third-party accessory

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Kit de desarrollo de software (SDK)

EP-DSP-TPR12-SECURITY Preliminary software & documents for early engagement customers

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Kit de desarrollo de software (SDK)

MCU-PLUS-SDK-AM273X MCU+ SDK for AM273x – RTOS, No-RTOS

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Kit de desarrollo de software (SDK)

MMWAVE-MCUPLUS-SDK mmWave SDK for AWR2944 and AM2732

The mmWave microcontroller (MCU) plus software development kit (SDK) is a collection of software packages that enable application evaluation and development on TI mmWave sensors. This tool includes the MMWAVE-MCUPLUS-SDK and companion packages to support your design needs.

MMWAVE-MCUPLUS-SDK is a (...)

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Primeros pasos

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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IDE, configuración, compilador o depurador

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Capacitación en línea

AM27X-ACADEMY AM27x Academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
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Sistema operativo (SO)

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Herramienta de programación de software

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Modelo de simulación

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
Modelo de simulación

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Modelo de simulación

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
Herramienta de cálculo

SPRM803 AM273x Power Estimation Tool

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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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