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CSD95481RWJ

NO RECOMENDADO PARA NUEVOS DISEÑOS

Etapa de potencia inteligente NexFET™ de reductor sincrónico de 60 A en tamaño estándar de la indust

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CSD95481RWJ no se recomienda para nuevos diseños
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CSD95411 ACTIVO Etapa de potencia NexFET™ buck sincrónica de corriente continua con picos de 65 A Improved device current rating and efficiency

CSD95481RWJ

NO RECOMENDADO PARA NUEVOS DISEÑOS
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Detalles del producto

Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
Rating Catalog VDS (V) 20 Ploss current (A) 30 Features Analog temperature output, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
VQFN-CLIP (RWJ) 41 30 mm² (6 mm × 5 mm)
  • 60-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 60-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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* Hoja de datos CSD95481RWJ Synchronous Buck NexFET Smart Power Stage datasheet PDF | HTML 16/06/2017

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