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CSD95492QVM

NO RECOMENDADO PARA NUEVOS DISEÑOS

Etapa de potencia inteligente NexFET de buck sincrónico de 20 A en un encapsulado pequeño SON de 4x5

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CSD95492QVM no se recomienda para nuevos diseños
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CSD95420RCB ACTIVO Etapa de potencia inteligente NexFET™ buck sincrónico continuo con picos de 50 A Improved device current rating and efficiency in an industry standard common footprint 4-mm x 5-mm package.

CSD95492QVM

NO RECOMENDADO PARA NUEVOS DISEÑOS
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Detalles del producto

Rating Catalog VDS (V) 20 Ploss current (A) 12 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
Rating Catalog VDS (V) 20 Ploss current (A) 12 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Operating temperature range (°C) -55 to 150
VSON-CLIP (DMH) 18 20 mm² (5 mm × 4 mm)
  • 20-A Continuous Operating Current Capability
  • Over 94% System Efficiency at 12 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density VSON 4-mm × 5-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 20-A Continuous Operating Current Capability
  • Over 94% System Efficiency at 12 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density VSON 4-mm × 5-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95492QVM NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4-mm × 5-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95492QVM NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4-mm × 5-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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* Hoja de datos CSD95492QVM Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) PDF | HTML 3/01/2018

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