DRA77P
SoC multinúcleo de alto rendimiento con periféricos ampliados e ISP para aplicaciones de cabina digi
DRA77P
- Architecture Designed for Infotainment Applications
- Video, Image, and Graphics Processing Support
- Full-HD Video (1920 × 1080p, 60 fps)
- Multiple Video Input and Video Output
- 2D and 3D Graphics
- Dual Arm® Cortex®-A15 Microprocessor Subsystem
- Up to Two C66x Floating-Point VLIW DSP
- Fully Object-Code Compatible with C67x and C64x+
- Up to Thirty-Two 16 x 16-Bit Fixed-Point Multiplies per Cycle
- Up to 2.5MB of On-Chip L3 RAM
- Level 3 (L3) and Level 4 (L4) Interconnects
- Two DDR2/DDR3/DDR3L Memory Interface (EMIF) Modules
- Supports up to DDR2-800 and DDR3-1333
- Up to 2GB Supported per EMIF
- Dual ARM® Cortex®-M4 Image Processing Units (IPU)
- Up to Two Embedded Vision Engines (EVEs)
- Imaging Subsystem (ISS)
- Image Signal Processor (ISP)
- Wide Dynamic Range and Lens Distortion Correction (WDR and Mesh LDC)
- One Camera Adaptation Layer (CAL_B)
- IVA Subsystem
- Display Subsystem
- Display Controller with DMA Engine and up to Three Pipelines
- HDMI™ Encoder: HDMI 1.4a and DVI 1.0 Compliant
- Video Processing Engine (VPE)
- 2D-Graphics Accelerator (BB2D) Subsystem
- Vivante® GC320 Core
- Dual-Core PowerVR® SGX544 3D GPU
- Two Video Input Port (VIP) Modules
- Support for up to Eight Multiplexed Input Ports
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) Controller
- 2-Port Gigabit Ethernet (GMAC)
- Sixteen 32-Bit General-Purpose Timers
- 32-Bit MPU Watchdog Timer
- Five Inter-Integrated Circuit (I2C) Ports
- HDQ™/1-Wire® Interface
- SATA Interface
- Media Local Bus (MLB) Subsystem
- Ten Configurable UART/IrDA/CIR Modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI (QSPI)
- Eight Multichannel Audio Serial Port (McASP) Modules
- SuperSpeed USB 3.0 Dual-Role Device
- Three High-Speed USB 2.0 Dual-Role Devices
- Four MultiMedia Card/Secure Digital/Secure Digital Input Output Interfaces (MMC™/SD®/SDIO)
- PCI Express® 3.0 Subsystems with Two 5-Gbps Lanes
- One 2-Lane Gen2-Compliant Port
- or Two 1-Lane Gen2-Compliant Ports
- Up to Two Controller Area Network (DCAN) Modules
- CAN 2.0B Protocol
- Modular Controller Area Network (MCAN) Module
- CAN 2.0B Protocol with Available FD (Flexible Data Rate) Functionality
- MIPI CSI-2 Camera Serial Interface
- Up to 247 General-Purpose I/O (GPIO) Pins
- Device Security Features
- Hardware Crypto Accelerators and DMA
- Firewalls
- JTAG® Lock
- Secure Keys
- Secure ROM and Boot
- Customer Programmable Keys and OTP Data
- Power, Reset, and Clock Management
- On-Chip Debug with CTools Technology
- 28-nm CMOS Technology
- 23 mm × 23 mm, 0.8-mm Pitch, 784-Pin BGA (ACD)
DRA77xP and DRA76xP (Jacinto 6 Plus) automotive applications processors are built to meet the intense processing needs of the modern digital cockpit automobile experiences.
The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly implement innovative connectivity technologies, speech recognition, audio streaming, and more. Jacinto 6 Plus devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set.
Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon™ extension, TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with one or more EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.
Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers and a debugging interface for visibility into source code.
Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.
The DRA77xP and DRA76xP Jacinto 6 Plus processor family is qualified according to the AEC-Q100 standard.
DRA77x and DRA76x (Jacinto 6 Plus) automotive applications processors are built to meet the intense processing needs of the modern digital cockpit automobile experiences.
The device enables Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly implement innovative connectivity technologies, speech recognition, audio streaming, and more. Jacinto 6 Plus devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution. The devices also combine programmable video processing with a highly integrated peripheral set.
Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon extension, TI C66x VLIW floating-point DSP core, and Vision AccelerationPac (with one or more EVEs). The Arm allows developers to keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.
Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers and a debugging interface for visibility into source code.
Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment are available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.
The DRA77x and DRA76x Jacinto 6 Plus processor family is qualified according to the AEC-Q100 standard.
Documentación técnica
| Documentación principal | Tipo | Título | Opciones de formato | Fecha |
|---|---|---|---|---|
| * | Errata | TDA2P, DRA7xxP, AM574x Package Discontinued and Redesigned (Rev. A) | PDF | HTML | 28 oct 2025 |
| * | Errata | DRA7xx Silicon Errata (Rev. B) | PDF | HTML | 08 sep 2024 |
| * | Data sheet | DRA77xP, DRA76xP Infotainment Applications Processor Silicon Revision 1.0 adds APB package notice datasheet (Rev. E) | 10 dic 2018 |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje