Información de empaque
| Encapsulado | Pines SOIC (D) | 8 |
| Rango de temperatura de funcionamiento (℃) -40 to 125 |
| Cant. de paquetes | Empresa de transporte 3,000 | LARGE T&R |
Características para ISO6721
- Functional Safety-Capable
- 50-Mbps data rate
- Robust isolation barrier:
- High lifetime at 450 VRMS working voltage
- Up to 3000 VRMS isolation rating
- ±150 kV/µs typical CMTI
- Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
- 1.71-V to 5.5-V level translation
- Default output High (ISO672xB) and Low (ISO672xFB) Options
- Wide temperature range: –40°C to +125°C
- 1.8 mA per channel typical at 1 Mbps
- Low propagation delay: 11 ns typical
- Robust electromagnetic compatibility (EMC)
- System-Level ESD, EFT, and surge immunity
- ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
- Low emissions
- Narrow-SOIC (D-8) package
- Safety-Related Certifications:
- DIN EN IEC 60747-17 (VDE 0884-17)
- UL 1577 component recognition program
- IEC 62368-1, IEC 61010-1, IEC 60601-1
- GB 4943.1
Descripción de ISO6721
The ISO672xB devices are high-performance, dual-channel digital isolators ideal for cost sensitive applications requiring up to 3000 VRMS (D package) isolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC.
The ISO672xB devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI’s double capacitive silicon dioxide (SiO2) insulation barrier. The ISO6720B device has 2 isolation channels with both channels in the same direction. The ISO6721B device has 2 isolation channels with 1 channel in each direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See Device Functional Modes section for further details.
Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as UART, SPI, RS-485, RS-232, and CAN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO672xB devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO672xB family of devices is available in a 8-pin SOIC narrow-body (D) package and is a pin-to-pin upgrade to the older generations. For reinforced isolation requirements, refer to the ISO672x-Q1.