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OMAP-L137

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DSP de punto flotante de baja potencia C674x + procesador Arm9 - hasta 456 MHz

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OMAP-L137

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Detalles del producto

CPU 1 Arm9 Frequency (MHz) 456 Coprocessors C674x DSP Display type 1 LCD Protocols Ethernet Hardware accelerators Industrial communications subsystem, Programable real-time unit Operating system Linux, RTOS Security Device attestation & anti-counterfeit, Secure storage Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 125
CPU 1 Arm9 Frequency (MHz) 456 Coprocessors C674x DSP Display type 1 LCD Protocols Ethernet Hardware accelerators Industrial communications subsystem, Programable real-time unit Operating system Linux, RTOS Security Device attestation & anti-counterfeit, Secure storage Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 125
PBGA (ZKB) 256 289 mm² (17 mm × 17 mm)
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • Dual Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • Embedded ICE-RT™ for Real-Time Debug
  • ARM9™ Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2736 MFLOPS C674x
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Fixed- and Floating-Point VLIW DSP Core
    • Load-Store Architecture with Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop
      Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • 128KB of RAM Shared Memory
  • 3.3-V LVCMOS I/Os (Except for USB Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM with 128-MB Address Space
    • EMIFB
      • 32-Bit or 16-Bit SDRAM with 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • UART0 with Modem Control Signals
    • Autoflow Control Signals (CTS, RTS) on UART0 Only
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
  • Two Master and Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load and Store RISC Architecture
      • 4KB of Instruction RAM per Core
      • 512 Bytes of Data RAM per Core
      • PRUSS can be Disabled via Software to Save Power
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) with Integrated PHY (USB1)
  • USB 2.0 OTG Port with Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
  • Three Multichannel Audio Serial Ports (McASPs):
    • Six Clock Zones and 28 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable (McASP2)
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • RMII Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Three Enhanced Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Time-Stamps
  • Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
  • Commercial, Industrial, Extended, or Automotive Temperature
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • Dual Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • Embedded ICE-RT™ for Real-Time Debug
  • ARM9™ Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2736 MFLOPS C674x
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Fixed- and Floating-Point VLIW DSP Core
    • Load-Store Architecture with Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop
      Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • 128KB of RAM Shared Memory
  • 3.3-V LVCMOS I/Os (Except for USB Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM with 128-MB Address Space
    • EMIFB
      • 32-Bit or 16-Bit SDRAM with 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • UART0 with Modem Control Signals
    • Autoflow Control Signals (CTS, RTS) on UART0 Only
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
  • Two Master and Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load and Store RISC Architecture
      • 4KB of Instruction RAM per Core
      • 512 Bytes of Data RAM per Core
      • PRUSS can be Disabled via Software to Save Power
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) with Integrated PHY (USB1)
  • USB 2.0 OTG Port with Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
  • Three Multichannel Audio Serial Ports (McASPs):
    • Six Clock Zones and 28 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable (McASP2)
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • RMII Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Three Enhanced Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Time-Stamps
  • Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
  • Commercial, Industrial, Extended, or Automotive Temperature

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Descargar la versión más reciente en inglés Fecha
* Hoja de datos OMAP-L137 Low-Power Applications Processor datasheet (Rev. G) PDF | HTML 17/06/2014
* Guía del usuario OMAP-L137 C6000 DSP+ARM Processor Technical Reference Manual (Rev. D) 21/09/2016
* Errata OMAP-L137 C6000 DSP+ARM Processor Errata (Silicon Revs 3.0, 2.1, 2.0, 1.1 & 1.0) (Rev. I) 17/06/2014
Guía del usuario ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 30/03/2023
Guía del usuario ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 30/03/2023
Nota sobre la aplicación High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 24/02/2023
Guía del usuario SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 1/06/2020
Nota sobre la aplicación General Hardware Design/BGA PCB Design/BGA PDF | HTML 22/02/2019
Nota sobre la aplicación OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 14/02/2019
Nota sobre la aplicación McASP Design Guide - Tips, Tricks, and Practical Examples 10/01/2019
Informe Designing professional audio mixers for every scenario 28/06/2018
Guía del usuario TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 21/08/2012
Guía del usuario TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 21/08/2012
Nota sobre la aplicación Using the OMAP-L1x7 Bootloader (Rev. G) 1/06/2012
Nota sobre la aplicación Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061 13/04/2012
Informe MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A) 2/02/2012
Nota sobre la aplicación Introduction to TMS320C6000 DSP Optimization 6/10/2011
Guía del usuario TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 14/09/2011
Informe OpenCV on TI’s DSP+ARM® 27/07/2011
Informe Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19/05/2011
Nota sobre la aplicación Power Solution Using Discrete DC/DC Converters and LDOs (Rev. B) 26/08/2010
Guía del usuario TMS320C674x DSP Megamodule Reference Guide (Rev. A) 3/08/2010
Guía del usuario TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 30/07/2010
Nota sobre la aplicación OMAP-L137 Power Consumption Summary 30/06/2010
Nota sobre la aplicación Power Solution using a Dual DCDC Converter and a LDO (Rev. A) 25/03/2010
Nota sobre la aplicación Power Solution using LDO's (Rev. A) 25/03/2010
Más documentación OMAP-L1x Software Solutions Diagram (Rev. B) 7/12/2009
Nota sobre la aplicación Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 25/11/2009
Nota sobre la aplicación OMAP-L137 TMS320C6747/6745/6743 Pin Multiplexing Utility (Rev. A) 26/09/2009
Nota sobre la aplicación OMAP-L137 Complementary Products 23/09/2009
Informe Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 24/06/2009
Nota sobre la aplicación TMS320C6747/45/43 & OMAP-L1x7 USB Downstream Host Compliance Testing 12/03/2009
Nota sobre la aplicación TMS320C6747/45/43 & OMAP-L1x7 USB Upstream Device Compliance Testing 12/03/2009
Nota sobre la aplicación TMS320C674x/OMAP-L1x USB Compliance Checklist 12/03/2009
Nota sobre la aplicación OMAP-L137 Technical Brief (Rev. B) 18/02/2009
Guía del usuario TMS320C674x DSP Cache User's Guide (Rev. A) 11/02/2009

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMDSOSKL137 — Kit básico de punto flotante OMAP-L137/TMS320C6747

The OMAP-L137/TMS320C6747 Floating-Point Starter Kit, developed jointly with Spectrum Digital Inc., is a low-cost development platform designed to speed the development of high-precision applications based on TI's OMAP-L13x applications processors and TMS320C674x fixed-/floating-point DSPs (...)

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Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. Para la mayoría de los dispositivos, se recomienda utilizar el XDS110 (www.ti.com/tool/TMDSEMU110-U), que es más nuevo y de menor costo. El XDS200 es compatible con una amplia variedad de (...)

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Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB para rastreo del sistema con el software XDS560™ v2

El XDS560v2 es el modelo de mayor rendimiento de la familia de sondas de depuración XDS560™ y es compatible tanto con el estándar JTAG tradicional (IEEE 1149.1) como con cJTAG (IEEE 1149.7).  Tenga en cuenta que no es compatible con la depuración por cable serie (SWD).

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Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-OMAPL137 — TI-RTOS Processor SDK for OMAP-L137 and C6747, C6745, C6743 (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

El procesador de kit de desarrollo de software (SDK) es una plataforma de software unificada para procesadores integrados de TI que ofrece una configuración sencilla y un rápido acceso inmediato a pruebas de rendimiento y demostraciones.  Todas las versiones del SDK del procesador son coherentes (...)

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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

Productos y hardware compatibles
Sistema operativo (SO)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
Desde: Mentor Graphics Corporation
Productos y hardware compatibles
Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
Productos y hardware compatibles
Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

La biblioteca de procesamiento de imágenes (IMGLIB) C5000/6000 es una biblioteca de funciones de procesamiento de imágenes o videos optimizada para programadores C. Incluye rutinas de procesamiento de imágenes/o videos de uso general invocables en C que se suelen utilizar en aplicaciones en tiempo (...)

Productos y hardware compatibles
Controlador o biblioteca

SPRC265 — Biblioteca DSP TMS320C6000 (DSPLIB)

La biblioteca de procesadores de señales digitales (DSPLIB) TMS320C6000 es una biblioteca de funciones DSP optimizada para la plataforma para programadores C. Incluye rutinas de procesamiento de señales de uso general e invocables en C que se suelen utilizar en aplicaciones en tiempo real de gran (...)

Productos y hardware compatibles
Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

Productos y hardware compatibles
Controlador o biblioteca

WIND-3P-VXWORKS-LINUX-OS — Procesadores Wind River VxWorks y sistemas operativos de Linux

Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)

Desde: Wind River Systems
Productos y hardware compatibles
Códec de software

ADT-3P-DSPVOIPCODECS — Tecnologías digitales adaptables DSP VOIP, códecs de voz y audio

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
Desde: Adaptive Digital Technologies, Inc.
Productos y hardware compatibles
Códec de software

AURO-3P-3DENGINE — Auro Technologies Auro-CODEC y software Auro-Matic

Auro Technologies’ Auro-Engine includes their Auro-Codec and Auro-Matic elements for real time audio stream encoding and up mixing affording 3D audio user experiences. The Auro-Codec and Auro-Matic algorithms have been ported to select TI C6x DSPs.
Desde: Auro Technologies N.V.
Productos y hardware compatibles
Modelo de simulación

OMAP-L137 ZKB BSDL Model (Rev. B)

SPRM328A (6 KB) - Modelo BSDL
Productos y hardware compatibles
Modelo de simulación

OMAP-L137 ZKB IBIS Model (Rev. A)

SPRM333A.ZIP (176 KB) - Modelo IBIS
Productos y hardware compatibles
Diseño de referencia

PR2084 — Alimentación de OMAP-L132/OMAP-L137/OMAP-L138 con TPS650061

This reference design presents a complete power solution and low-cost, discrete sequencing circuit for the OMAP-L132, OMAP-L137, and OMAP-L138 processors.
Productos y hardware compatibles
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
PBGA (ZKB) 256 Ultra Librarian
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