The TMUX1104 is a precision complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1104 offers a single channel, 4:1 configuration. A wide operating supply of 1.08V to 5.5V makes this device an excellent choice for a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1104 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 5nA and small package options enable use in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX1104 5V, Low-Leakage-Current, 4:1 Precision Multiplexer datasheet (Rev. C) | PDF | HTML | 02 feb 2024 |
| Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 26 jul 2022 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Technical article | Your solution for measuring blood glucose levels just got smaller and more accurat | PDF | HTML | 12 feb 2019 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 10 dic 2018 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| USON (DQA) | 10 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
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