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UC1710-SP

ACTIVO

QMLV de grado espacial, controlador de compuerta de canal único 6 A/6 A con UVLO de 5 V y tierra

Detalles del producto

Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) -55 to 125 Fall time (ns) 20 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Space Driver configuration Complementary
Number of channels 1 Power switch IGBT, MOSFET Peak output current (A) 6 Input supply voltage (min) (V) 4.7 Input supply voltage (max) (V) 18 Features Thermal shutdown Operating temperature range (°C) -55 to 125 Fall time (ns) 20 Input threshold CMOS Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Space Driver configuration Complementary
CDIP (JG) 8 64.032 mm² 9.6 x 6.67
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages
  • Totem Pole Output with 6A Source/Sink Drive
  • 3ns Delay
  • 20ns Rise and Fall Time into 2.2nF
  • 8ns Rise and Fall Time into 30nF
  • 4.7V to 18V Operation
  • Inverting and Non-Inverting Outputs
  • Under-Voltage Lockout with Hysteresis
  • Thermal Shutdown Protection
  • MINIDIP and Power Packages

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.

The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET\x92s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A.

Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis.

The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for \x9655°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of \x9640°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available.

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Limited design support from TI available

Existing projects using this product have limited design support from TI. If available, you will find relevant collateral, tools and software on this page. Existing designs using this product have limited design support from TI. Request limited design support in the TI E2E™ support forums.

Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet High Current FET Driver datasheet 05 sep 1999

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

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