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製品詳細

Number of channels 2 Power switch IGBT, MOSFET Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
Number of channels 2 Power switch IGBT, MOSFET Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
HVSSOP (DGN) 8 14.7 mm² (3 mm × 4.9 mm)
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

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上位の文書 タイプ タイトル フォーマットオプション 最新の英語版をダウンロード 日付
* データシート UCC2742x-EP Dual 4-A High-Speed Low-Side MOSFET Driver With Enable データシート (Rev. C) PDF | HTML 2014/12/23
* 放射線と信頼性レポート UCC27424MDGNREP Reliability Report 2012/01/05

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