CD54AC273

활성

리셋을 지원하는 8진 D형 플립플롭

제품 상세 정보

Number of channels 8 Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 160 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 100 IOL (max) (mA) 24 IOH (max) (mA) -24 Supply current (max) (µA) 160 Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92
  • Buffered Inputs
  • Typical Propagation Delay
    • 6.5ns at VCC = 5V, TA = 25°C, CL = 50pF
  • Exceeds 2kV ESD Protection MIL-STD-883, Method 3015
  • SCR-Latchup-Resistant CMOS Process and Circuit Design
  • Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply
  • ±24mA Output Drive Current
    • Fanout to 15 FAST™ ICs
    • Drives 50 Transmission Lines

Data sheet acquired from Harris Semiconductor
FAST™ is a Trademark of Fairchild Semiconductor.

  • Buffered Inputs
  • Typical Propagation Delay
    • 6.5ns at VCC = 5V, TA = 25°C, CL = 50pF
  • Exceeds 2kV ESD Protection MIL-STD-883, Method 3015
  • SCR-Latchup-Resistant CMOS Process and Circuit Design
  • Speed of Bipolar FAST™/AS/S with Significantly Reduced Power Consumption
  • Balanced Propagation Delays
  • AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply
  • ±24mA Output Drive Current
    • Fanout to 15 FAST™ ICs
    • Drives 50 Transmission Lines

Data sheet acquired from Harris Semiconductor
FAST™ is a Trademark of Fairchild Semiconductor.

The ’AC273 and ’ACT273 devices are octal D-type flip-flops with reset that utilize advanced CMOS logic technology. Information at the D input is transferred to the Q output on the positive-going edge of the clock pulse. All eight flip-flops are controlled by a common clock (CP) and a common reset (MR)\. Resetting is accomplished by a low voltage level independent of the clock.

The ’AC273 and ’ACT273 devices are octal D-type flip-flops with reset that utilize advanced CMOS logic technology. Information at the D input is transferred to the Q output on the positive-going edge of the clock pulse. All eight flip-flops are controlled by a common clock (CP) and a common reset (MR)\. Resetting is accomplished by a low voltage level independent of the clock.

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기술 문서

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모두 보기14
유형 직함 날짜
* Data sheet Octal D Flip-Flop with Reset datasheet (Rev. B) 2002/07/01
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
More literature HiRel Unitrode Power Management Brochure 2009/07/07
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

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패키지 다운로드
CDIP (J) 20 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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