CD54HCT541
- ’HC540, CD74HCT540: inverting
- ’HC541, ’HCT541: non-inverting
- Buffered inputs
- Three-state outputs
- Bus line driving capability
- Typical propagation delay = 9 ns at VCC = 5 V, CL = 15 pF, TA = 25℃
- Fanout (over temperature range)
- Standard outputs: 10 LSTTL loads
- Bus driver outputs: 15 LSTTL loads
- Wide operating temperature range: –55℃ to 125℃
- Balanced propagation delay and transition times
- Significant power reduction compared to LSTTL Logic ICs
- HC types
- 2 V to 6 V operation
- High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V
- HCT types
- 4.5 V to 5.5 V operation
- Direct LSTTL input logic compatibility, VIL = 0.8 V (max), VIH = 2 V (min)
- CMOS input compatibility, II ≤ 1 µA at VOL, VOH
기술 자료
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12개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CDx4HC(T)541 High-Speed CMOS Logic Octal Buffer and Line Drivers Three-State datasheet (Rev. E) | PDF | HTML | 2022/10/14 |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
User guide | Signal Switch Data Book (Rev. A) | 2003/11/14 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | SN54/74HCT CMOS Logic Family Applications and Restrictions | 1996/05/01 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 20 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치