CDC3RL02
- Low Additive Noise:
- –149 dBc/Hz at 10-kHz Offset Phase Noise
- 0.37 ps (RMS) Output Jitter
- Limited Output Slew Rate for EMI Reduction (1- to 5-ns Rise/Fall Time for 10-pF to 50-pF Loads)
- Adaptive Output Stage Controls Reflection
- Regulated 1.8-V Externally Available I/O Supply
- Ultra-Small 8-bump YFP 0.4-mm Pitch WCSP (0.8 mm × 1.6 mm)
- ESD Performance Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 1000-V Charged-Device Model (JESD22-C101-A Level III)
The CDC3RL02 is a two-channel clock fan-out buffer and is ideal for use in portable end-equipment, such as mobile phones, that require clock buffering with minimal additive phase noise and fan-out capabilities. It buffers a single master clock, such as a temperature compensated crystal oscillator (TCXO) to multiple peripherals. The device has two clock request inputs (CLK_REQ1 and CLK_REQ2), each of which enable a single clock output.
The CDC3RL02 accepts square or sine waves at the master clock input (MCLK_IN), eliminating the need for an AC coupling capacitor. The smallest acceptable sine wave is a 0.3-V signal (peak-to-peak). CDC3RL02 has been designed to offer minimal channel-to-channel skew, additive output jitter, and additive phase noise. The adaptive clock output buffers offer controlled slew-rate over a wide capacitive loading range which minimizes EMI emissions, maintains signal integrity, and minimizes ringing caused by signal reflections on the clock distribution lines.
The CDC3RL02 has an integrated Low-Drop-Out (LDO) voltage regulator which accepts input voltages from 2.3 V to 5.5 V and outputs 1.8 V, 50 mA. This 1.8-V supply is externally available to provide regulated power to peripheral devices such as a TCXO.
The CDC3RL02 is offered in a 0.4-mm pitch wafer-level chip-scale (WCSP) package (0.8 mm × 1.6 mm) and is optimized for very low standby current consumption.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | CDC3RL02 Low Phase-Noise Two-Channel Clock Fan-Out Buffer datasheet (Rev. G) | PDF | HTML | 2022/11/18 |
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YFP) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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