CY54FCT377T

활성

활성화 기능이 있는 8진 D형 플립플롭

제품 상세 정보

Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Fully Compatible With TTL Input and Output Logic Levels
  • Clock Enable for Address and Data Synchronization Application
  • Eight Edge-Triggered D-Type Flip-Flops
  • CY54FCT377T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT377T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Fully Compatible With TTL Input and Output Logic Levels
  • Clock Enable for Address and Data Synchronization Application
  • Eight Edge-Triggered D-Type Flip-Flops
  • CY54FCT377T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT377T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

The \x92FCT377T devices have eight triggered D-type flip-flops with individual data (D) inputs. The common buffered clock (CP) inputs load all flip-flops simultaneously when the clock-enable (CE\) input is low. The register is fully edge triggered. The state of each D input at one setup time before the low-to-high clock transition is transferred to the corresponding flip-flop output (O). CE\ must be stable only one setup time prior to the low-to-high clock transition for predictable operation.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT377T devices have eight triggered D-type flip-flops with individual data (D) inputs. The common buffered clock (CP) inputs load all flip-flops simultaneously when the clock-enable (CE\) input is low. The register is fully edge triggered. The state of each D input at one setup time before the low-to-high clock transition is transferred to the corresponding flip-flop output (O). CE\ must be stable only one setup time prior to the low-to-high clock transition for predictable operation.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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기술 문서

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모두 보기10
유형 직함 날짜
* Data sheet 8-Bit Registers datasheet (Rev. A) 2001/10/01
* SMD CY54FCT377T SMD 5962-92219 2016/06/21
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
User guide CYFCT Parameter Measurement Information 2001/04/02
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09

설계 및 개발

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패키지 다운로드
LCCC (FK) 20 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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