ESD762
- Robust surge protection:
- IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
- IEC 61000-4-2 level 4 ESD protection:
- ±30-kV or ±20-kV contact discharge
- ±30-kV or ±20-kV air-gap discharge
- 24 V working voltage
- Bidirectional ESD protection
- 2-channel device provides complete ESD and surge protection with single component
- Low clamping voltage protects downstream components
- I/O capacitance = 3 pF or 1.7 pF (typical)
- SOT-23 (DBZ) small, standard, common footprint
- SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
- Leaded packages used for automatic optical inspection (AOI)
The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.
These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.
The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.
관심 가지실만한 유사 제품
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기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | ESD752 and ESD762 24-V, 2-Channel, ESD Protection With 5.7 A of 8/20 µsSurge Protection in a SOT-23 and SOT-323 / SC-70 Package datasheet (Rev. B) | PDF | HTML | 2022/11/22 |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 |
설계 및 개발
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ESDEVM — 일반 ESD 평가 모듈
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
(...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
TIDA-010253 — Battery control unit reference design for energy storage systems
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| SOT-23 (DBZ) | 3 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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