LP3988-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- Operating Input Voltage 2.5 V to 6 V
- Power-Good Flag Output
- Logic-Controlled Enable
- Stable With Ceramic and High-Quality Tantalum Capacitors
- Fast Turnon
- Thermal Shutdown and Short-Circuit Current Limit
- 5-Pin SOT-23 Package
The LP3988-Q1 is a 150-mA low-dropout regulator designed specially to meet requirements of portable battery applications. The LP3988-Q1 works with a space-saving 1-µF ceramic capacitor. The LP3988-Q1 features an error flag-output that indicates a faulty output condition.
The LP3988-Q1 has performance optimized for battery-powered systems to deliver low noise, extremely low dropout voltage, and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life.
Power-supply rejection is better than 60 dB at low frequencies and starts to roll off at 10 kHz. The device maintains high power-supply rejection down to lower input voltage levels common to battery-operated circuits.
The device is ideal for mobile phone and similar battery-powered wireless applications. It provides up to 150 mA, from a 2.5-V to 6-V input, consuming less than 1 µA in disable mode, and has fast turnon time less than 200 µs.
The LP3988-Q1 is available in a 5-pin SOT-23 package, has performance specified for the −40°C to +125°C temperature range, and is available in a 2.85-V output voltage. For other voltage options, contact TI sales.
For all available packages, see the orderable addendum at the end of the data sheet.기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | LP3988-Q1 Micropower, 150-mA Ultra-Low-Dropout CMOS LDO With Power Good datasheet (Rev. B) | PDF | HTML | 2016/11/28 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOT-23 (DBV) | 5 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치