SN54AHCT541

Name: SN54AHCT541
Brand: TI
SKU: SN54AHCT541
Price: 28.115 USD

활성

TTL 호환 CMOS 입력을 지원하는 군사용 8채널, 4.5V~5.5V 버퍼

지금 주문

데이터 시트

document-pdfAcrobat SNx4AHCT541 Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. Q) (영어) PDF | HTML

SN54AHCT541

활성

데이터 시트

지금 주문

제품 상세 정보

Technology family

AHCT

Supply voltage (min) (V)

4.5

Supply voltage (max) (V)

5.5

Number of channels

IOL (max) (mA)

Supply current (max) (µA)

IOH (max) (mA)

-8

Input type

TTL-Compatible CMOS

Output type

Push-Pull

Features

Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)

Rating

Military

Operating temperature range (°C)

-55 to 125

Technology family

AHCT

Supply voltage (min) (V)

4.5

Supply voltage (max) (V)

5.5

Number of channels

IOL (max) (mA)

Supply current (max) (µA)

IOH (max) (mA)

-8

Input type

TTL-Compatible CMOS

Output type

Push-Pull

Features

Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)

Rating

Military

Operating temperature range (°C)

-55 to 125

CDIP (J)

167.464 mm² 24.2 x 6.92

CFP (W)

90.5828 mm² 13.09 x 6.92

LCCC (FK)

79.0321 mm² 8.89 x 8.89

Inputs are TTL-voltage compatible
Latch-up performance exceeds 250mA per JESD 17
ESD protection exceeds JESD 22
- 2000V human-body model (A114-A)
- 1000V charged-device model (C101)
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

Inputs are TTL-voltage compatible
Latch-up performance exceeds 250mA per JESD 17
ESD protection exceeds JESD 22
- 2000V human-body model (A114-A)
- 1000V charged-device model (C101)
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

The ’AHCT541 octal buffers/drivers are ideal for driving bus lines or buffer memory address registers. These devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.

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