SN54LS373-SP
- Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package
- 3-State Bus-Driving Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374)
- P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)
These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight latches of the LS373 and S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.
The eight flip-flops of the LS374 and S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.
Schmitt-trigger buffered inputs at the enable/clock lines of the S373 and S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.
OC\ does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.
기술 자료
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 20 | Ultra Librarian |
CFP (W) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치