제품 상세 정보

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 24 IOH (max) (mA) -15 Input type TTL Output type TTL Features High speed (tpd 10-50ns) Technology family LS Rating Catalog Operating temperature range (°C) 0 to 70
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Number of channels 8 IOL (max) (mA) 24 IOH (max) (mA) -15 Input type TTL Output type TTL Features High speed (tpd 10-50ns) Technology family LS Rating Catalog Operating temperature range (°C) 0 to 70
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • Bus Transceivers/Registers
  • Independent Registers and Enables for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Choice of True and Inverting Data Paths
  • Choice of 3-State or Open-Collector Outputs to A Bus
  • Dependable Texas Instruments Quality and Reliability
  • Bus Transceivers/Registers
  • Independent Registers and Enables for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Choice of True and Inverting Data Paths
  • Choice of 3-State or Open-Collector Outputs to A Bus
  • Dependable Texas Instruments Quality and Reliability

These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Enable GAB and G\BA are provided to control the transceiver functions. SAB and SBA control pins are provided to select whether realtime or stored data is transferred. A low input level selects real-time data, and a high selects stored data. The following examples demonstrate the four fundamental bus-management functions that can be performed with the 'LS651, 'LS652, and 'LS653.

Data on the A or B data bus, or both, can be stored in the internal D flip-flop by low-to-high transitions at the appropriate clock pins (CAB or CBA) regardless of the select or enable control pins. When SAB or SBA are in the real-time transfer mode, it is also possible to store data without using the internal D-type flip-flops by simultaneously enabling GAB and G\BA. In this configuration each output reinforces its input. Thus, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines will remain at its last state.

The SN54LS651 through SN54LS653 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LS651 through SN74LS653 are characterized for operation from 0°C to 70°C.

These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Enable GAB and G\BA are provided to control the transceiver functions. SAB and SBA control pins are provided to select whether realtime or stored data is transferred. A low input level selects real-time data, and a high selects stored data. The following examples demonstrate the four fundamental bus-management functions that can be performed with the 'LS651, 'LS652, and 'LS653.

Data on the A or B data bus, or both, can be stored in the internal D flip-flop by low-to-high transitions at the appropriate clock pins (CAB or CBA) regardless of the select or enable control pins. When SAB or SBA are in the real-time transfer mode, it is also possible to store data without using the internal D-type flip-flops by simultaneously enabling GAB and G\BA. In this configuration each output reinforces its input. Thus, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines will remain at its last state.

The SN54LS651 through SN54LS653 are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LS651 through SN74LS653 are characterized for operation from 0°C to 70°C.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
CD74ACT245 활성 3상 출력을 지원하는 8진 비인버팅 버스 트랜시버 Shorter average propagation delay (8ns), higher average drive strength (24mA)

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* Data sheet Octal Bus Transceivers And Registers datasheet (Rev. A) 2000/12/11

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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