홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 비인버팅 버퍼 및 드라이버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
비인버팅 버퍼 및 드라이버

SN74LVTH125

활성

버스 홀드, TTL 호환 CMOS 입력 및 3상 출력을 지원하는 4채널, 2.7V~3.6V 버퍼

지금 주문
데이터시트

SN74LVTH125

활성
데이터시트 지금 주문

제품 상세 정보

Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 64 Supply current (max) (µA) 7000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 4 IOL (max) (mA) 64 Supply current (max) (µA) 7000 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 14 51.9 mm² 8.65 x 6 SOP (NS) 14 79.56 mm² 10.2 x 7.8 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23.04 mm² 3.6 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

These bus buffers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

These bus buffers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The ’LVTH125 devices feature independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE)\ input is high.

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
open-in-new 기타 비인버팅 버퍼 및 드라이버 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
SN74AHCT125 활성 TTL 호환 CMOS 입력 및 3상 출력을 지원하는 4채널 4.5V~5.5V 버퍼 Larger voltage range (2V to 5.5V)

기술 문서

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모두 보기18
유형 직함 날짜
* Data sheet SN54LVTH125, SN74LVTH125 datasheet (Rev. I) 2003/10/13
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018/09/17
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Simultaneous-Switching Performance of TI Logic Devices (Rev. B) 2005/02/23
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note LVT-to-LVTH Conversion 1998/12/08
Application note LVT Family Characteristics (Rev. A) 1998/03/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈

14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
평가 보드

14-24-NL-LOGIC-EVM — 14핀~24핀 비 리드 패키지용 로직 제품 일반 평가 모듈

14-24-NL-LOGIC-EVM은 14핀~24핀 BQA, BQB, RGY, RSV, RJW 또는 RHL 패키지가 있는 로직 또는 변환 디바이스를 지원하도록 설계된 유연한 평가 모듈(EVM)입니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

SN74LVTH125 Behavioral SPICE Model

SCBM115.ZIP (7 KB) - PSpice Model
다운로드
시뮬레이션 모델

SN74LVTH125 IBIS Model

SCEM176.ZIP (16 KB) - IBIS Model
다운로드
패키지 핀 다운로드
SOIC (D) 14 옵션 보기
SOP (NS) 14 옵션 보기
SSOP (DB) 14 옵션 보기
TSSOP (PW) 14 옵션 보기
TVSOP (DGV) 14 옵션 보기
VQFN (RGY) 14 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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