TPA0202
- Integrated Depop Circuitry
- High Power with PC Power Supply
- 2 W/Ch at 5 V into a 3- Load
- 800 mW/Ch at 3 V
- Fully Specified for Use With 3- Loads
- Ultra-Low Distortion
- 0.05% THD+N at 2 W and 3- Load - Bridge-Tied Load (BTL) or Single-Ended (SE) Modes
- Stereo Input MUX
- Surface-Mount Power Package
24-Pin TSSOP PowerPADTM - Shutdown Control...IDD = 5 uA
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPA0202 is a stereo audio power amplifier in a 24-pin TSSOP thermal package capable of delivering greater than 2 W of continuous RMS power per channel into 3- loads with a 3.3-V supply voltage.
The TPA0202 has integrated depop circuitry that virtually eliminates transients that cause noise in the speakers during power up and when using the mute and shutdown modes.
Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 2 to 20 in BTL mode (1 to 10 in SE mode). An internal input MUX allows two sets of stereo inputs to the amplifier. In notebook applications, where internal speakers are driven as BTL and the line (often headphone drive) outputs are required to be SE, the TPA0202 automatically switches into SE mode when the SE/BTL\ input is activated. Using the TPA0202 to drive line outputs up to 700 mW/channel into external 3- loads is ideal for small non-powered external speakers in portable multimedia systems. The TPA0202 also features a shutdown function for power sensitive applications, holding the supply current at 5 uA.
The PowerPAD package loads, the operating ambient temperature increases to 100°C.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPA0202 - Stereo 2-W Audio Power Amplifier datasheet (Rev. B) | 2000/12/14 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/07/06 | ||
User guide | TPA0202EVM - User Guide | 1998/05/12 |
설계 및 개발
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패키지 | 핀 | 다운로드 |
---|---|---|
HTSSOP (PWP) | 24 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치