DRV8824-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified with the Following Results:
- Device Temperature Grade 1: –40°C to +125°C
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- PWM Microstepping Motor Driver
- Built-In Microstepping Indexer
- Five-Bit Winding Current Control Allows Up to
32 Current Levels - Low MOSFET On-Resistance
- 1.6-A Maximum Drive Current at 24 V, 25°C
- Built-In 3.3-V Reference Output
- 8.2-V to 45-V Operating Supply Voltage Range
- Thermally Enhanced HTSSOP Surface Mount Package
The DRV8824-Q1 provides an integrated motor driver solution for automotive applications. The device has two H-bridge drivers and a microstepping indexer, and is intended to drive a bipolar stepper motor. The output driver block for each consists of N-channel power MOSFET’s configured as full H-bridges to drive the motor windings. The DRV8824-Q1 is capable of driving up to 1.6-A of output current (with proper heatsinking, at 24 V and 25°C).
A simple step/direction interface allows easy interfacing to controller circuits. Terminals allow configuration of the motor in full-step up to 1/32-step modes. Decay mode is programmable.
Internal shutdown functions are provided for overcurrent protection, short circuit protection, undervoltage lockout and overtemperature.
The DRV8824-Q1 is available in a 28-terminal HTSSOP package with PowerPAD (Eco-friendly: RoHS & no Sb/Br).
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技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | DRV8824-Q1 Automotive Motor Controller IC datasheet | PDF | HTML | 2014/4/9 | ||
| 應用說明 | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 2021/10/14 | |||
| 應用說明 | Methods to Configure Current Regulation for Brushed and Stepper Motors (Rev. B) | PDF | HTML | 2021/1/19 | |||
| 應用說明 | Protecting Automotive Motor Drive Systems from Reverse Polarity Conditions (Rev. A) | 2019/2/19 | ||||
| 應用說明 | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/7/6 | ||||
| 更多文件說明 | TM4C123x Stepper Motor Control Product Summary | 2015/7/6 | ||||
| Application brief | PowerPAD™ Made Easy (Rev. B) | 2004/5/12 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 28 | Ultra Librarian |