LM4890
- Available in Space-Saving Packages: DSBGA, VSSOP, SOIC, and WSON
- Ultra Low Current Shutdown Mode
- BTL Output Can Drive Capacitive Loads
- Improved Pop & Click Circuitry Eliminates Noises During Turn-On and Turn-Off Transitions
- 2.2 - 5.5V Operation
- No Output Coupling Capacitors, Snubber Networks or Bootstrap Capacitors Required
- Thermal Shutdown Protection
- Unity-Gain Stable
- External Gain Configuration Capability
Key Specifications
- PSRR at 217Hz, VDD = 5V (Fig. 1): 62dB(typ.)
- Power Output at 5.0V & 1% THD: 1W(typ.)
- Power Output at 3.3V & 1% THD: 400mW(typ.)
- Shutdown Current: 0.1μA(typ.)
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The LM4890 is an audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1 watt of continuous average power to an 8Ω BTL load with less than 1% distortion (THD+N) from a 5VDC power supply.
Boomer audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of external components. The LM4890 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.
The LM4890 features a low-power consumption shutdown mode, which is achieved by driving the shutdown pin with logic low. Additionally, the LM4890 features an internal thermal shutdown protection mechanism.
The LM4890 contains advanced pop & click circuitry which eliminates noises which would otherwise occur during turn-on and turn-off transitions.
The LM4890 is unity-gain stable and can be configured by external gain-setting resistors.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LM4890 1 Watt Audio Power Amplifier datasheet (Rev. L) | 2013年 5月 3日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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