TPA6211A1
- Designed for Wireless or Cellular Handsets and
PDAs - 3.1 W Into 3 Ω From a 5-V Supply at
THD = 10% (Typ) - Low Supply Current: 4 mA Typ at 5 V
- Shutdown Current: 0.01 µA Typ
- Fast Startup With Minimal Pop
- Only Three External Components
- Improved PSRR (–80 dB) and Wide Supply
Voltage (2.5 V to 5.5 V) for Direct Battery
Operation - Fully Differential Design Reduces RF
Rectification - –63 dB CMRR Eliminates Two Input
Coupling Capacitors
- Improved PSRR (–80 dB) and Wide Supply
The TPA6211A1 is a 3.1-W mono fully-differential amplifier designed to drive a speaker with at least 3-Ω impedance while consuming only 20 mm2 total printed-circuit board (PCB) area in most applications. The device operates from 2.5 V to 5.5 V, drawing only 4 mA of quiescent supply current. The TPA6211A1 is available in the space-saving 3-mm × 3-mm SON (DRB) and the 8-pin MSOP-PowerPAD (DGN) packages.
Features like –80 dB supply voltage rejection from 20 Hz to 2 kHz, improved RF rectification immunity, small PCB area, and a fast startup with minimal pop makes the TPA6211A1 ideal for PDA and smart phone applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPA6211A1 3.1-W Mono Fully Differential Audio Power Amplifier datasheet (Rev. E) | PDF | HTML | 2015年 11月 24日 |
| Application brief | Hardware-Based Smart DAC Medical Alarm Design (Rev. A) | PDF | HTML | 2023年 5月 4日 | |
| Application brief | MSPM0-Based Medical Alarm Design | PDF | HTML | 2023年 4月 26日 | |
| User guide | TPA6211A1EVM - User Guide | 2003年 7月 22日 |
設計與開發
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TPA6211A1EVM — TPA6211A1 評估模組 (EVM)
The TPA6211A1 is a 3.1-W mono fully differential amplifier designed to drive a speaker with at least 3-Ohm impedance while comsuming less than 20mm2 total board space.
The device operates from 2.5V to 5.5V while consuming only 4mA of quiescent current. The TPA6211A1 is available in a space-saving (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HVSSOP (DGN) | 8 | Ultra Librarian |
| VSON (DRB) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。