TPS62864
- 7-mΩ and 6.5-mΩ internal power MOSFETs
- >90% efficiency (0.9-V output)
- DCS-control topology for fast transient response
- 1% output voltage accuracy
- 4-µA operating quiescent current
- 2.4-V to 5.5-V input voltage range
- 2.4-MHz switching frequency
- Selection by external resistor
- Start-up output voltage
- I2C slave address
- Selection by I2C interface
- Power save mode or forced PWM mode
- Output discharge
- Hiccup or latching short-circuit protection
- Output voltage ramp speed
- VID pin for dynamic voltage scaling (DVS)
- Thermal pre-warning and thermal shutdown
- Power good indicator pin option
- I2C-compatible interface up to 3.4 Mbps
- Available in 1.05-mm x 1.78-mm x 0.5-mm 15-pin WCSP package with 0.35-mm pitch
- Create a custom design using the TPS62866 with the WEBENCH® Power Designer
The TPS62864 and TPS62866 devices are high-frequency synchronous step-down converters with I2C interface which provide an efficient, adaptive, and high power-density solution. At medium to heavy loads, the converter operates in PWM mode and automatically enters Power Save Mode operation at light load to maintain high efficiency over the entire load current range. The device can also be forced in PWM mode operation for smallest output voltage ripple. Together with its DCS-control architecture, excellent load transient performance and tight output voltage accuracy are achieved. Via the I2C interface and a dedicated VID pin, the output voltage is quickly adjusted to adapt the power consumption of the load to the ever-changing performance needs of the application.
技術文件
設計與開發
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TPS62866EVM-051 — 具 I2C 介面的高功率密度 6-A 降壓轉換器評估模組
TPS62866EVM-051 評估模組 (EVM) 有助於評估採用小型 1.05mm x 1.78mm WCSP 封裝、節距為 0.5mm 的 TPS62866 6 A 降壓轉換器。該 EVM 透過 I2C 的可編程輸出電壓為 0.4V 至 1.675V,在 2.4V 和 5.5V 之間的輸入電壓下具有 1% 的準確度。TPS62866 是一款高效率且高功率密度的解決方案,適合於有限空間應用的負載點 (POL) 轉換器,例如 FPGA ,攝影機模組及固態硬碟 (SSD)。
TIDA-050044 — 適用於 M.2 外型規格固態硬碟的小型高效電源供應參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YCG) | 15 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。