UC1845A-SP

現行

50% 工作週期、抗輻射 QMLV、30-V 輸入、1-A 單輸出 500-kHz PWM 控制器

產品詳細資料

Vin (max) (V) 25 Operating temperature range (°C) -55 to 125 Control mode Current Topology Boost, Flyback, Forward Rating Space Duty cycle (max) (%) 50
Vin (max) (V) 25 Operating temperature range (°C) -55 to 125 Control mode Current Topology Boost, Flyback, Forward Rating Space Duty cycle (max) (%) 50
CDIP (JG) 8 64.032 mm² 9.6 x 6.67 CFP (HKU) 10 45.4896 mm² 7.02 x 6.48 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • QML Class V (QMLV) Qualified, SMD 5962-86704
  • 5962P8670411Vxx: (1)
    • Radiation Hardness Assurance (RHA) up to
      30-krad(Si) Total Ionizing Dose (TID)
    • Passes Functional and Specified Post-Radiation Parametric Limits at 45 krad at LDR (10 mrad(Si)/s) per 1.5× Over Test as Defined in MIL-STD-883 Test Method 1019.9 Paragraph 3.13.3.b
    • Exhibits Low Dose Rate Sensitivity (2) but Remains Within the Pre-Radiation Electrical Limits at 30-krad Total Dose Level, as Allowed by MIL-STD-883, TM1019
  • Optimized for DC-to-DC Converter Applications
  • Low Start-Up Current (< 0.5 mA)
  • Trimmed Oscillator Discharge Current
  • Automatic Feed Forward Compensation
  • Pulse-by-Pulse Current Limiting
  • Enhanced Load Response Characteristics
  • Undervoltage Lockout (UVLO) With Hysteresis
  • Double-Pulse Suppression
  • High-Current Totem-Pole Output
  • Internally-Trimmed Bandgap Reference
  • 500-kHz Operation
  • Low RO Error Amplifier
  • Qualified Over the Military Temperature Range (–55°C to 125°C)

(1)Improved TID radiation performance only applies to RHA device type 11.

(2)The affected parameter Reference Output Voltage, VREF Radiation Drift Curve (see VREF Radiation Drift Curve).

  • QML Class V (QMLV) Qualified, SMD 5962-86704
  • 5962P8670411Vxx: (1)
    • Radiation Hardness Assurance (RHA) up to
      30-krad(Si) Total Ionizing Dose (TID)
    • Passes Functional and Specified Post-Radiation Parametric Limits at 45 krad at LDR (10 mrad(Si)/s) per 1.5× Over Test as Defined in MIL-STD-883 Test Method 1019.9 Paragraph 3.13.3.b
    • Exhibits Low Dose Rate Sensitivity (2) but Remains Within the Pre-Radiation Electrical Limits at 30-krad Total Dose Level, as Allowed by MIL-STD-883, TM1019
  • Optimized for DC-to-DC Converter Applications
  • Low Start-Up Current (< 0.5 mA)
  • Trimmed Oscillator Discharge Current
  • Automatic Feed Forward Compensation
  • Pulse-by-Pulse Current Limiting
  • Enhanced Load Response Characteristics
  • Undervoltage Lockout (UVLO) With Hysteresis
  • Double-Pulse Suppression
  • High-Current Totem-Pole Output
  • Internally-Trimmed Bandgap Reference
  • 500-kHz Operation
  • Low RO Error Amplifier
  • Qualified Over the Military Temperature Range (–55°C to 125°C)

(1)Improved TID radiation performance only applies to RHA device type 11.

(2)The affected parameter Reference Output Voltage, VREF Radiation Drift Curve (see VREF Radiation Drift Curve).

The UC1845A-SP control IC is a radiation hardened pin-for-pin compatible version of the UC184x family. It is primarily suited for Satellites and other harsh environment applications. Providing the necessary characteristics to control current-mode switched-mode power supplies, this device has improved features. Start-up current is specified to be less than 0.5 mA and oscillator discharge is trimmed to 8.3 mA. During UVLO, the output stage can sink at least 10 mA at less than 1.2 V for VCC over 5 V.

The Device Comparison Table shows the difference between members of this family. Reference the individual product data sheets for ordering the radiation-improved version if available.

The UC1845A-SP control IC is a radiation hardened pin-for-pin compatible version of the UC184x family. It is primarily suited for Satellites and other harsh environment applications. Providing the necessary characteristics to control current-mode switched-mode power supplies, this device has improved features. Start-up current is specified to be less than 0.5 mA and oscillator discharge is trimmed to 8.3 mA. During UVLO, the output stage can sink at least 10 mA at less than 1.2 V for VCC over 5 V.

The Device Comparison Table shows the difference between members of this family. Reference the individual product data sheets for ordering the radiation-improved version if available.

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技術文件

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類型 標題 日期
* Data sheet UC1845A-SP QML class V, radiation hardened current-mode PWM controller datasheet (Rev. A) PDF | HTML 2019年 2月 21日
* Radiation & reliability report UC1845A-SP Neutron Displacement Damage Characterization Test Report 2021年 5月 5日
* SMD UC1845A-SP SMD 5962-86704 2016年 7月 8日
* Radiation & reliability report UC1845A-SP TID Radiation Test Report 2015年 5月 19日
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023年 8月 31日
Application note QML flow, its importance, and obtaining lot information (Rev. C) 2023年 8月 30日
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 2022年 11月 17日
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 2022年 10月 19日
Selection guide TI Space Products (Rev. I) 2022年 3月 3日
Application brief Controlling Input Power for Present and Next-Generation Power Controllers PDF | HTML 2020年 12月 14日
Application note DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer 2020年 8月 21日
Application note Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form PDF | HTML 2020年 5月 18日
E-book Radiation Handbook for Electronics (Rev. A) 2019年 5月 21日
Technical article Power Tips: Calculate an R-C snubber in seven steps PDF | HTML 2016年 5月 5日

設計與開發

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模擬型號

UC1845A-SP TINA-TI Transient Reference Design

SLUM676.TSC (6353 KB) - TINA-TI Reference Design
模擬型號

UC1845A-SP TINA-TI Transient Spice Model

SLUM677.ZIP (19 KB) - TINA-TI Spice Model
模擬型號

UC1845A-SP Unencrypted PSpice Transient Model

SLUM665.ZIP (3 KB) - PSpice Model
封裝 引腳 下載
CDIP (JG) 8 檢視選項
CFP (HKU) 10 檢視選項
LCCC (FK) 20 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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