SN65DSI85 dual-channel MIPI® DSI to dual-link FlatLink™ LVDS bridge evaluation module


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The SN65DSI85EVM evaluation module (EVM) is a printed circuit board (PCB) that helps customers implementthe SN65DSI85 device in system hardware. This EVM can be used as a hardware reference design for any implementation using the SN65DSI85 device. The SN65DSI85EVM includes onboard connectors for DSI input and LVDS output signals.  These connectors are for connecting MIPI® DPHY-compliant DSI source and LVDS panels to the EVM.

  • Plug and play design
  • Two input options for DSI video signal (QSH-type connector and FX-type connector)
  • Two output port options available for the LVDS output signals (QSH-type connector and I-PEX-type connector)
  • I2C interface to configure internal registers
  • LED backlight driver circuitry using TI's backlight driver device, TPS61181A
  • Configurable through switches

  • SN65DSI85EVM board

HDMI, DisplayPort & MIPI ICs
SN65DSI84 MIPI® DSI bridge to Flatlink™ LVDS single-channel DSI to dual-link LVDS bridge SN65DSI85 Dual-channel MIPI® DSI to dual-link Flatlink™ LVDS bridge


Backlight LED drivers
TPS61181A Six Strings LED driver for notebook application


Clock generators
CDCEL913 Programmable 1-PLL VCXO clock synthesizer with 1.8-V LVCMOS outputs


Linear & low-dropout (LDO) regulators
REG104 1-A, 15-V, low-dropout voltage regulator with enable TPS74201 1.5-A, low-VIN (0.8-V), low-noise, high-PSRR, adjustable ultra-low-dropout voltage regulator


Supervisor & reset ICs
TPS3808 Low-quiescent current supervisor with programmable delay & manual reset
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Evaluation board

SN65DSI85EVM — SN65DSI85 dual-channel MIPI® DSI to dual-link FlatLink™ LVDS bridge evaluation module

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Technical documentation

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Type Title Date
* EVM User's guide SN65DSI83, SN65DSI84, and SN65DSI85 EVM User’s Manual and Implementation Guide 17 Nov 2015
Data sheet SN65DSI85 MIPI® DSI Bridge to FlatLink LVDS Dual Channel DSI to Dual-Link LVDS datasheet (Rev. G) 01 Oct 2020
Certificate SN65DSI85EVM EU Declaration of Conformity (DoC) 02 Jan 2019

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