High density isolated PoE and GigE reference design for machine vision cameras and vision sensors


Design files


Power over Ethernet (PoE) offers an easy and reliable solution to combine power and data in one cable with high data rate and long reach. This combination makes PoE ideal for small devices such as machine vision cameras and vision sensors. This reference design implements a complete PoE powered device (PD) including a 1-Gb/s physical layer and a highly efficient, isolated power solution in a very small form factor of 27 x 27 mm.

  • IEEE802.3at PoE Type 1 PD Class 0: 13 W
  • Flyback with synchronous rectification
    • Optocouplerless primary side feedback
    • 5-V output, accuracy better than ±2%
    • Up to 92% efficiency
  • Additional 24-V auxiliary input
  • 10/100/1000 Mbit/s Ethernet
  • RGMII interface
  • 1x isolated digital outputs
  • 2x isolated digital inputs
  • Small form factor of 27 x 27 mm
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUEU3.PDF (9304 K)

Reference design overview and verified performance test data

TIDM244.PDF (2477 K)

Detailed schematic diagram for design layout and components

TIDM245.PDF (63 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDM246.PDF (278 K)

Detailed overview of design layout for component placement

TIDM248.ZIP (3250 K)

Files used for 3D models or 2D drawings of IC components


Design file that contains information on physical board layer of design PCB

TIDM247.PDF (1436 K)

PCB layer plot file used for generating PCB design layout


Includes TI products in the design and potential alternatives.

Powered devices

TPS23758IEEE 802.3at PoE PD with no-opto sync flyback DC-DC controller

Data sheet: PDF
AC/DC & DC/DC converters (integrated FET)

TPS628011.75-V to 5.5-V input, 1-A ultra-low IQ step-down converter in 0.7-mm x 1.05-mm chip scale package

Data sheet: PDF | HTML
AC/DC & DC/DC converters (integrated FET)

TPS628021.75-V to 5.5-V input, 1-A ultra-low IQ step-down converter in 0.7-mm x 1.05-mm chip scale package

Data sheet: PDF | HTML
Ethernet PHYs

DP83867IRIndustrial temperature, robust gigabit Ethernet PHY transceiver

Data sheet: PDF | HTML
Ideal diode/ORing controllers

LM74700-Q13.2-V to 65-V, 80-uA IQ automotive ideal diode controller

Data sheet: PDF | HTML
Isolated digital inputs

ISO1212Dual-channel Isolated 24-V to 60-V digital input receiver for digital input modules

Data sheet: PDF | HTML

CSD17579Q3A30-V, N channel NexFET™ power MOSFET, single SON 3 mm x 3 mm, 14.2 mOhm

Data sheet: PDF | HTML

CSD19538Q2100-V, N channel NexFET™ power MOSFET, single SON 2 mm x 2 mm, 59 mOhm

Data sheet: PDF | HTML
TVS diodes

TVS330033V flat-clamp surge protection device

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
* Design guide High Density Isolated PoE and GigE Reference Design for Machine Vision Cameras Oct. 10, 2019
Analog Design Journal A small-footprint PoE solution for machine-vision cameras and sensors Sep. 30, 2019

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