TIDA-01531

Low-Power Wireless M-Bus Communications Module Reference Design

TIDA-01531

Design files

Overview

This reference design explains how to use the TI wireless M-Bus stack for CC1310 and CC1350 wireless MCUs and integrate it into a smart meter or data-collector product. This software stack is compatible with the Open Metering System (OMS) v3.0.1 specification. EN13757-1 through EN13757-7 are European standards for meter reading and include both wired and wireless metering-bus (M-Bus); these together are very popular in ultra-low-power metering and sub-metering applications. This design offers ready-to-use binary images for any of the wireless M-Bus S-, T-, or C-modes at 868 MHz with unidirectional (meter) or bidirectional configurations (both meter and data collector). Multiple precompiled binary images are provided that cover metering applications, including but not limited to heat cost allocators (HCAs), gas, water, and heat meters, or e-meters with an external host MCU.

Features
  • Meets EN13757-4 class HR requirements for sensitivity and selectivity and class HT for transmit power in S-, T-, and C-modes
  • Complete single-chip implementation with serial interface to host MCU
  • Consumes only 0.7 µA @ 3.6 V in shutdown mode
  • Embedded (API level) interface for combining wM-Bus stack and meter application
  • wM-Bus OMSv3.0.1-compliant S- and T- modes (S1, S2, T1, T2) with C1 and C2 modes added
  • Supports meter and data collector (also called "Other") functionality

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUDG0.PDF (7932 K)

Reference design overview and verified performance test data

TIDRST2.PDF (129 K)

Detailed schematic diagram for design layout and components

TIDRST3.PDF (50 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRST4.PDF (52 K)

Detailed overview of design layout for component placement

TIDRST6.ZIP (3366 K)

Files used for 3D models or 2D drawings of IC components

TIDCDV1.ZIP (300 K)

Design file that contains information on physical board layer of design PCB

TIDRST5.PDF (1083 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Multi-protocol products

CC1350SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU with 128kB Flash

Data sheet document-pdfAcrobat PDF open-in-new HTML
Sub-1 GHz products

CC1310SimpleLink™ 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash

Data sheet document-pdfAcrobat PDF open-in-new HTML

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Software

Support software

TI Wireless M-Bus Stack – TIDCDV2.ZIP (4991 K)

Technical documentation

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Type Title Date
* Design guide Low-Power wM-Bus Communications Module Reference Design Sep. 22, 2017
Application note Low-power wM-Bus Stack Implementation With CC1310 and CC1350 Oct. 19, 2018
Application note Using the MSP430FR6047 Wireless M-Bus Serial Library for Metering Applications Apr. 05, 2018

Related design resources

Hardware development

EVALUATION BOARD
LAUNCHXL-CC1310 SimpleLink™ Sub-1 GHz CC1310 wireless MCU LaunchPad™ development kit
DEVELOPMENT KIT
LAUNCHXL-CC1350 SimpleLink™ Dual-Band CC1350 Wireless MCU LaunchPad Development Kit

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