SCLS374P May 1997 – April 2024 SN74AHCT595
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN74AHCT595 | UNIT | ||||||
---|---|---|---|---|---|---|---|---|
BQB (WQFN) | D (SOIC) | DB (SSOP) | N (PDIP) | NS (SOP) | PW (TSSOP) | |||
16 PINS | ||||||||
RθJA | Junction-to-ambient thermal resistance | 91.8 | 80.2 | 97.5 | 47.5 | 126.2 | 135.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 87.7 | 39.1 | 47.7 | 34.9 | 68.7 | 70.3 | |
RθJB | Junction-to-board thermal resistance | 61.6 | 27.7 | 48.1 | 27.5 | 77.3 | 81.3 | |
ψJT | Junction-to-top characterization parameter | 11.9 | 9.9 | 9.8 | 19.8 | 22.3 | 22.5 | |
ψJB | Junction-to-board characterization parameter | 61.4 | 37.4 | 47.6 | 27.4 | 76.9 | 80.8 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 39.4 | n/a | n/a | n/a | n/a | n/a |