SPRSP85 April   2024 TMS320F28P550SJ , TMS320F28P559SJ-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
    3. 5.3 Signal Descriptions
      1. 5.3.1 Analog Signals
      2. 5.3.2 Digital Signals
      3. 5.3.3 Power and Ground
      4. 5.3.4 Test, JTAG, and Reset
    4. 5.4 Pin Multiplexing
      1. 5.4.1 GPIO Muxed Pins
      2. 5.4.2 Digital Inputs on ADC Pins (AIOs)
      3. 5.4.3 Digital Inputs and Outputs on ADC Pins (AGPIOs)
      4. 5.4.4 GPIO Input X-BAR
      5. 5.4.5 GPIO Output X-BAR, CLB X-BAR, CLB Output X-BAR, and ePWM X-BAR
    5. 5.5 Pins With Internal Pullup and Pulldown
    6. 5.6 Connections for Unused Pins
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings – Commercial
    3. 6.3  ESD Ratings – Automotive
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Power Consumption Summary
      1. 6.5.1 System Current Consumption - VREG Enable - Internal Supply
      2. 6.5.2 System Current Consumption - VREG Disable - External Supply
      3. 6.5.3 Operating Mode Test Description
      4. 6.5.4 Reducing Current Consumption
        1. 6.5.4.1 Typical Current Reduction per Disabled Peripheral
    6. 6.6  Electrical Characteristics
    7. 6.7  Thermal Resistance Characteristics for PDT Package
    8. 6.8  Thermal Resistance Characteristics for PZ Package
    9. 6.9  Thermal Resistance Characteristics for PNA Package
    10. 6.10 Thermal Resistance Characteristics for PM Package
    11. 6.11 Thermal Resistance Characteristics for RSH Package
    12. 6.12 Thermal Design Considerations
    13. 6.13 System
      1. 6.13.1  Power Management Module (PMM)
        1. 6.13.1.1 Introduction
        2. 6.13.1.2 Overview
          1. 6.13.1.2.1 Power Rail Monitors
            1. 6.13.1.2.1.1 I/O POR (Power-On Reset) Monitor
            2. 6.13.1.2.1.2 I/O BOR (Brown-Out Reset) Monitor
            3. 6.13.1.2.1.3 VDD POR (Power-On Reset) Monitor
          2. 6.13.1.2.2 External Supervisor Usage
          3. 6.13.1.2.3 Delay Blocks
          4. 6.13.1.2.4 Internal 1.2-V LDO Voltage Regulator (VREG)
          5. 6.13.1.2.5 VREGENZ
        3. 6.13.1.3 External Components
          1. 6.13.1.3.1 Decoupling Capacitors
            1. 6.13.1.3.1.1 VDDIO Decoupling
            2. 6.13.1.3.1.2 VDD Decoupling
        4. 6.13.1.4 Power Sequencing
          1. 6.13.1.4.1 Supply Pins Ganging
          2. 6.13.1.4.2 Signal Pins Power Sequence
          3. 6.13.1.4.3 Supply Pins Power Sequence
            1. 6.13.1.4.3.1 External VREG/VDD Mode Sequence
            2. 6.13.1.4.3.2 Internal VREG/VDD Mode Sequence
            3. 6.13.1.4.3.3 Supply Sequencing Summary and Effects of Violations
            4. 6.13.1.4.3.4 Supply Slew Rate
        5. 6.13.1.5 Power Management Module Electrical Data and Timing
          1. 6.13.1.5.1 Power Management Module Operating Conditions
          2. 6.13.1.5.2 Power Management Module Characteristics
      2. 6.13.2  Reset Timing
        1. 6.13.2.1 Reset Sources
        2. 6.13.2.2 Reset Electrical Data and Timing
          1. 6.13.2.2.1 Reset - XRSn - Timing Requirements
          2. 6.13.2.2.2 Reset - XRSn - Switching Characteristics
          3. 6.13.2.2.3 Reset Timing Diagrams
      3. 6.13.3  Clock Specifications
        1. 6.13.3.1 Clock Sources
        2. 6.13.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 6.13.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. 6.13.3.2.1.1 Input Clock Frequency
            2. 6.13.3.2.1.2 XTAL Oscillator Characteristics
            3. 6.13.3.2.1.3 X1 Input Level Characteristics When Using an External Clock Source - Not a Crystal
            4. 6.13.3.2.1.4 X1 Timing Requirements
            5. 6.13.3.2.1.5 AUXCLKIN Timing Requirements
            6. 6.13.3.2.1.6 APLL Characteristics
            7. 6.13.3.2.1.7 XCLKOUT Switching Characteristics - PLL Bypassed or Enabled
            8. 6.13.3.2.1.8 Internal Clock Frequencies
        3. 6.13.3.3 Input Clocks and PLLs
        4. 6.13.3.4 XTAL Oscillator
          1. 6.13.3.4.1 Introduction
          2. 6.13.3.4.2 Overview
            1. 6.13.3.4.2.1 Electrical Oscillator
              1. 6.13.3.4.2.1.1 Modes of Operation
                1. 6.13.3.4.2.1.1.1 Crystal Mode of Operation
                2. 6.13.3.4.2.1.1.2 Single-Ended Mode of Operation
              2. 6.13.3.4.2.1.2 XTAL Output on XCLKOUT
            2. 6.13.3.4.2.2 Quartz Crystal
            3. 6.13.3.4.2.3 GPIO Modes of Operation
          3. 6.13.3.4.3 Functional Operation
            1. 6.13.3.4.3.1 ESR – Effective Series Resistance
            2. 6.13.3.4.3.2 Rneg – Negative Resistance
            3. 6.13.3.4.3.3 Start-up Time
              1. 6.13.3.4.3.3.1 X1/X2 Precondition
            4. 6.13.3.4.3.4 DL – Drive Level
          4. 6.13.3.4.4 How to Choose a Crystal
          5. 6.13.3.4.5 Testing
          6. 6.13.3.4.6 Common Problems and Debug Tips
          7. 6.13.3.4.7 Crystal Oscillator Specifications
            1. 6.13.3.4.7.1 Crystal Oscillator Electrical Characteristics
            2. 6.13.3.4.7.2 Crystal Equivalent Series Resistance (ESR) Requirements
            3. 6.13.3.4.7.3 Crystal Oscillator Parameters
            4. 6.13.3.4.7.4 Crystal Oscillator Electrical Characteristics
        5. 6.13.3.5 Internal Oscillators
          1. 6.13.3.5.1 INTOSC Characteristics
      4. 6.13.4  Flash Parameters
        1. 6.13.4.1 Flash Parameters 
      5. 6.13.5  RAM Specifications
      6. 6.13.6  ROM Specifications
      7. 6.13.7  Emulation/JTAG
        1. 6.13.7.1 JTAG Electrical Data and Timing
          1. 6.13.7.1.1 JTAG Timing Requirements
          2. 6.13.7.1.2 JTAG Switching Characteristics
          3. 6.13.7.1.3 JTAG Timing Diagram
        2. 6.13.7.2 cJTAG Electrical Data and Timing
          1. 6.13.7.2.1 cJTAG Timing Requirements
          2. 6.13.7.2.2 cJTAG Switching Characteristics
          3. 6.13.7.2.3 cJTAG Timing Diagram
      8. 6.13.8  GPIO Electrical Data and Timing
        1. 6.13.8.1 GPIO – Output Timing
          1. 6.13.8.1.1 General-Purpose Output Switching Characteristics
          2. 6.13.8.1.2 General-Purpose Output Timing Diagram
        2. 6.13.8.2 GPIO – Input Timing
          1. 6.13.8.2.1 General-Purpose Input Timing Requirements
          2. 6.13.8.2.2 Sampling Mode
        3. 6.13.8.3 Sampling Window Width for Input Signals
      9. 6.13.9  Interrupts
        1. 6.13.9.1 External Interrupt (XINT) Electrical Data and Timing
          1. 6.13.9.1.1 External Interrupt Timing Requirements
          2. 6.13.9.1.2 External Interrupt Switching Characteristics
          3. 6.13.9.1.3 External Interrupt Timing
      10. 6.13.10 Low-Power Modes
        1. 6.13.10.1 Clock-Gating Low-Power Modes
        2. 6.13.10.2 Low-Power Mode Wake-up Timing
          1. 6.13.10.2.1 IDLE Mode Timing Requirements
          2. 6.13.10.2.2 IDLE Mode Switching Characteristics
          3. 6.13.10.2.3 IDLE Entry and Exit Timing Diagram
          4. 6.13.10.2.4 STANDBY Mode Timing Requirements
          5. 6.13.10.2.5 STANDBY Mode Switching Characteristics
          6. 6.13.10.2.6 STANDBY Entry and Exit Timing Diagram
          7. 6.13.10.2.7 HALT Mode Timing Requirements
          8. 6.13.10.2.8 HALT Mode Switching Characteristics
          9. 6.13.10.2.9 HALT Entry and Exit Timing Diagram
    14. 6.14 Analog Peripherals
      1. 6.14.1 Block Diagram
      2. 6.14.2 Analog Pins and Internal Connections
      3. 6.14.3 Analog Signal Descriptions
      4. 6.14.4 Analog-to-Digital Converter (ADC)
        1. 6.14.4.1 ADC Configurability
          1. 6.14.4.1.1 Signal Mode
        2. 6.14.4.2 ADC Electrical Data and Timing
          1. 6.14.4.2.1 ADC Operating Conditions
          2. 6.14.4.2.2 ADC Characteristics
          3. 6.14.4.2.3 ADC INL and DNL
          4. 6.14.4.2.4 ADC Input Model
          5. 6.14.4.2.5 ADC Timing Diagrams
      5. 6.14.5 Temperature Sensor
        1. 6.14.5.1 Temperature Sensor Electrical Data and Timing
          1. 6.14.5.1.1 Temperature Sensor Characteristics
      6. 6.14.6 Comparator Subsystem (CMPSS)
        1. 6.14.6.1 CMPx_DACL
        2. 6.14.6.2 CMPSS Connectivity Diagram
        3. 6.14.6.3 Block Diagram
        4. 6.14.6.4 CMPSS Electrical Data and Timing
          1. 6.14.6.4.1 CMPSS Comparator Electrical Characteristics
          2.        CMPSS Comparator Input Referred Offset and Hysteresis
          3. 6.14.6.4.2 CMPSS DAC Static Electrical Characteristics
          4. 6.14.6.4.3 CMPSS Illustrative Graphs
          5. 6.14.6.4.4 Buffered Output from CMPx_DACL Operating Conditions
          6. 6.14.6.4.5 Buffered Output from CMPx_DACL Electrical Characteristics
      7. 6.14.7 Buffered Digital-to-Analog Converter (DAC)
        1. 6.14.7.1 Buffered DAC Electrical Data and Timing
          1. 6.14.7.1.1 Buffered DAC Operating Conditions
          2. 6.14.7.1.2 Buffered DAC Electrical Characteristics
      8. 6.14.8 Programmable Gain Amplifier (PGA)
        1. 6.14.8.1 PGA Electrical Data and Timing
          1. 6.14.8.1.1 PGA Operating Conditions
          2. 6.14.8.1.2 PGA Characteristics
    15. 6.15 Control Peripherals
      1. 6.15.1 Enhanced Pulse Width Modulator (ePWM)
        1. 6.15.1.1 Control Peripherals Synchronization
        2. 6.15.1.2 ePWM Electrical Data and Timing
          1. 6.15.1.2.1 ePWM Timing Requirements
          2. 6.15.1.2.2 ePWM Switching Characteristics
          3. 6.15.1.2.3 Trip-Zone Input Timing
            1. 6.15.1.2.3.1 Trip-Zone Input Timing Requirements
            2. 6.15.1.2.3.2 PWM Hi-Z Characteristics Timing Diagram
      2. 6.15.2 High-Resolution Pulse Width Modulator (HRPWM)
        1. 6.15.2.1 HRPWM Electrical Data and Timing
          1. 6.15.2.1.1 High-Resolution PWM Characteristics
      3. 6.15.3 External ADC Start-of-Conversion Electrical Data and Timing
        1. 6.15.3.1 External ADC Start-of-Conversion Switching Characteristics
        2. 6.15.3.2 ADCSOCAO or ADCSOCBO Timing Diagram
      4. 6.15.4 Enhanced Capture (eCAP)
        1. 6.15.4.1 eCAP Block Diagram
        2. 6.15.4.2 eCAP Synchronization
        3. 6.15.4.3 eCAP Electrical Data and Timing
          1. 6.15.4.3.1 eCAP Timing Requirements
          2. 6.15.4.3.2 eCAP Switching Characteristics
      5. 6.15.5 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 6.15.5.1 eQEP Electrical Data and Timing
          1. 6.15.5.1.1 eQEP Timing Requirements
          2. 6.15.5.1.2 eQEP Switching Characteristics
    16. 6.16 Communications Peripherals
      1. 6.16.1 Modular Controller Area Network (MCAN)
      2. 6.16.2 Inter-Integrated Circuit (I2C)
        1. 6.16.2.1 I2C Electrical Data and Timing
          1. 6.16.2.1.1 I2C Timing Requirements
          2. 6.16.2.1.2 I2C Switching Characteristics
          3. 6.16.2.1.3 I2C Timing Diagram
      3. 6.16.3 Power Management Bus (PMBus) Interface
        1. 6.16.3.1 PMBus Electrical Data and Timing
          1. 6.16.3.1.1 PMBus Electrical Characteristics
          2. 6.16.3.1.2 PMBus Fast Plus Mode Switching Characteristics
          3. 6.16.3.1.3 PMBus Fast Mode Switching Characteristics
          4. 6.16.3.1.4 PMBus Standard Mode Switching Characteristics
      4. 6.16.4 Serial Communications Interface (SCI)
      5. 6.16.5 Serial Peripheral Interface (SPI)
        1. 6.16.5.1 SPI Controller Mode Timings
          1. 6.16.5.1.1 SPI Controller Mode Timing Requirements
          2. 6.16.5.1.2 SPI Controller Mode Switching Characteristics - Clock Phase 0
          3. 6.16.5.1.3 SPI Controller Mode Switching Characteristics - Clock Phase 1
          4. 6.16.5.1.4 SPI Controller Mode Timing Diagrams
        2. 6.16.5.2 SPI Peripheral Mode Timings
          1. 6.16.5.2.1 SPI Peripheral Mode Timing Requirements
          2. 6.16.5.2.2 SPI Peripheral Mode Switching Characteristics
          3. 6.16.5.2.3 SPI Peripheral Mode Timing Diagrams
      6. 6.16.6 Local Interconnect Network (LIN)
      7. 6.16.7 Fast Serial Interface (FSI)
        1. 6.16.7.1 FSI Transmitter
          1. 6.16.7.1.1 FSITX Electrical Data and Timing
            1. 6.16.7.1.1.1 FSITX Switching Characteristics
            2. 6.16.7.1.1.2 FSITX Timings
        2. 6.16.7.2 FSI Receiver
          1. 6.16.7.2.1 FSIRX Electrical Data and Timing
            1. 6.16.7.2.1.1 FSIRX Timing Requirements
            2. 6.16.7.2.1.2 FSIRX Switching Characteristics
            3. 6.16.7.2.1.3 FSIRX Timings
        3. 6.16.7.3 FSI SPI Compatibility Mode
          1. 6.16.7.3.1 FSITX SPI Signaling Mode Electrical Data and Timing
            1. 6.16.7.3.1.1 FSITX SPI Signaling Mode Switching Characteristics
            2. 6.16.7.3.1.2 FSITX SPI Signaling Mode Timings
      8. 6.16.8 Universal Serial Bus (USB)
        1. 6.16.8.1 USB Electrical Data and Timing
          1. 6.16.8.1.1 USB Input Ports DP and DM Timing Requirements
          2. 6.16.8.1.2 USB Output Ports DP and DM Switching Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Memory
      1. 7.3.1 Memory Map
        1. 7.3.1.1 Dedicated RAM (Mx RAM)
        2. 7.3.1.2 Local Shared RAM (LSx RAM)
        3. 7.3.1.3 Global Shared RAM (GSx RAM)
        4. 7.3.1.4 Message RAM
      2. 7.3.2 Control Law Accelerator (CLA) Memory Map
      3. 7.3.3 Flash Memory Map
        1. 7.3.3.1 Addresses of Flash Sectors
      4. 7.3.4 Peripheral Registers Memory Map
    4. 7.4  Identification
    5. 7.5  Bus Architecture – Peripheral Connectivity
    6. 7.6  C28x Processor
      1. 7.6.1 Floating-Point Unit (FPU)
      2. 7.6.2 Trigonometric Math Unit (TMU)
      3. 7.6.3 VCRC Unit
    7. 7.7  Control Law Accelerator (CLA)
    8. 7.8  Embedded Real-Time Analysis and Diagnostic (ERAD)
    9. 7.9  Direct Memory Access (DMA)
    10. 7.10 Device Boot Modes
      1. 7.10.1 Device Boot Configurations
        1. 7.10.1.1 Configuring Boot Mode Pins
        2. 7.10.1.2 Configuring Boot Mode Table Options
      2. 7.10.2 GPIO Assignments
    11. 7.11 Security
      1. 7.11.1 Securing the Boundary of the Chip
        1. 7.11.1.1 JTAGLOCK
        2. 7.11.1.2 Zero-pin Boot
      2. 7.11.2 Dual-Zone Security
      3. 7.11.3 Disclaimer
    12. 7.12 Watchdog
    13. 7.13 C28x Timers
    14. 7.14 Dual-Clock Comparator (DCC)
      1. 7.14.1 Features
      2. 7.14.2 Mapping of DCCx Clock Source Inputs
    15. 7.15 Configurable Logic Block (CLB)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 TI Reference Design
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Markings
    3. 9.3 Tools and Software
    4. 9.4 Documentation Support
    5. 9.5 Support Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     TAPE AND REEL INFORMATION
    2.     TRAY

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PNA|80
  • PM|64
  • RSH|56
  • PZ|100
  • PDT|128
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 Device Comparison
FEATURE(1)(4) F28P559SJ-Q1(3) F28P550SJ F28P559SG-Q1(3) F28P550SG F28P550SD
C28x Subsystem
Frequency (MHz) 150
C28x 32-bit Floating-Point Unit (FPU) Yes
VCRC Yes
TMU - Type 1 Yes - Type 1 - NLPID Instruction Supported
CLA - Type 2 Number 1: F28P559SJ9-Q1, F28P559SJ6-Q1
0: F28P559SJ2-Q1		 1 1: F28P559SG9-Q1,F28P559SG8-Q1
0: F28P559SG2-Q1		 1
Frequency (MHz) 150
6-Channel DMA - Type 0 1
External Interrupts 5
MIPS 300 (CPU + CLA)
Memory
Flash Main Array 1MB (4 x 256KB Banks) 512KB (2 x 256KB Banks) 256KB (2 x 128KB Banks)
64KB Bank F28P559SJ9-Q1, F28P550SJ9, F28P559SJ6-Q1, F28P550SJ6, F28P559SG9-Q1, F28P550SG9 -
User OTP 8KB 2KB
RAM Dedicated 4KB
Local Shared RAM 64KB 32KB
Message 1KB
Global Shared RAM 64KB 32KB
Total RAM 133KB 101KB 69KB
Message RAM Types C28x CPUs and CLAs 512 bytes (256 bytes per direction)
DMAs and CLAs 512 bytes (256 bytes per direction)
ECC FLASH, Mx RAM
Parity ROM, CAN RAM, Message RAM, LSx RAM, GSx RAM
System
Configurable Logic Block (CLB) 2 tiles - F28P559SJ9-Q1, F28P559SJ6-Q1, F28P550SJ9, F28P550SJ6, F28P559SG9-Q1, F28P550SG9, F28P559SG8-Q1, F28P550SG8, F28P550SD7
Neural-Network Processing Unit (NNPU) 1 - F28P559SJ9-Q1, F28P550SJ9, F28P559SG9-Q1, F28P550SG9 -
Embedded Pattern Generator (EPG) 1
32-bit CPU Timers 3
Advanced Encryption Standard (AES) Accelerator 1
Live Firmware Update (LFU) Support Yes, with enhancements and flash bank erase time improvements
Security for on-chip flash and RAM Yes
Zero-pin Boot Yes
Secure Boot Yes
JTAG Lock Yes

MPOST

 Yes
Embedded Real-time Analysis and Diagnostic (ERAD) - Type 2 1
Non-maskable Interrupt Watchdog (NMIWD) timers 1
Watchdog (WD) timers 1
Crystal oscillator/External clock input 1
Internal Oscillator (Optional External Precision Resistor) 2
Digital and Analog Pin Counts
GPIO 128-pin PDT 65 65 - F28P559SG9-Q1, F28P550SG9 -
100-pin PZ 43
80-pin PNA 32
64-pin PM 17
56-pin RSH - 15 - 15
Additional GPIO 4 (2 from cJTAG and 2 from X1/X2)
AIO (analog with digital inputs) 128-pin PDT 17 17 - F28P559SG9-Q1, F28P550SG9 -
100-pin PZ 16 16
80-pin PNA 12
64-pin PM 12
56-pin RSH - 12 - 12
AGPIO (analog with digital inputs and outputs) 128-pin PDT 22 22 - F28P559SG9-Q1, F28P550SG9 -
100-pin PZ 19
80-pin PNA 16
64-pin PM 16
56-pin RSH - 14 - 14
C28x Analog Peripherals(5)
Analog-to-Digital Converter (ADC) (12-bit) - Type 6 Number of ADCs 5
MSPS 3.9
Conversion Time (ns)(2) 187
ADC Input channels (single-ended) (includes the two DAC outputs) 128-pin PDT 39 39 - F28P559SG9-Q1, F28P550SG9 -
100-pin PZ 35
80-pin PNA 28
64-pin PM 28
56-pin RSH 26 26
PGA - Type 2 3
Temperature Sensor 1
Comparator subsystem (CMPSS) (each CMPSS has two comparators and two internal DACs) - Type 6 4
Buffered Digital-to-Analog Converter (DAC) - Type 2 1
DAC Out from CMPSS 1
C28x Control Peripherals(5)
eCAP - Type 2 Total inputs 2
ePWM/HRPWM - Type 4 Total channels 24 - F28P559SJ9-Q1,F28P559SJ6-Q1
16 - F28P559J2-Q1		 24 24 - F28P559SG9-Q1, F28P559SG8-Q1
16 - F28P559SG2		 24
Channels with high-resolution capability 12- F28P559SJ9-Q1,F28P559SJ6-Q1
8 - F28P559SJ2-Q1		 12 12 - F28P559SG9-Q1, F28P559SG8-Q1
8 - F28P559SG2		 12
eQEP modules - Type 2 3
C28x Communications Peripherals(5)
CAN with Flexible Data-Rate (CAN-FD) - Type 2 2
Fast Serial Interface (FSI) RX - Type 2 1
Fast Serial Interface (FSI) TX - Type 2 1
Inter-Integrated Circuit (I2C) - Type 2 2
Local Interconnect Network (LIN) - Type 1 1
Power Management Bus (PMBus) - Type 1 1
Serial Communications Interface (SCI) - Type 0 (UART-compatible) 3
Serial Peripheral Interface (SPI) - Type 2 2
Universal Serial Bus (USB) - Type 0 1 - F28P559SJ9-Q1, F28P550SJ9, F28P559SJ6-Q1, F28P550SJ6 1 - F28P559SG9-Q1, F28P550SG9 -
Temperature and Qualification
Junction temperature (TJ) -40°C to 150°C
Free-Air temperature (TA) -40°C to 125°C
Package Options 128-pin PDT F28P559SJ9-Q1, F28P559SJ6-Q1, F28P559SJ2-Q1, F28P550SJ9, F28P550SJ6, F28P559SG9-Q1, F28P550SG9 -
100-pin PZ F28P559SJ9-Q1, F28P559SJ6-Q1, F28P559SJ2-Q1, F28P550SJ9, F28P550SJ6, F28P559SG9-Q1,F28P559SG8-Q1, F28P559SG2-Q1, F28P550SG9, F28P550SG8, F28P550SD7
80-pin PNA F28P559SJ9-Q1, F28P559SJ6-Q1, F28P559SJ2-Q1, F28P550SJ9, F28P550SJ6, F28P559SG9-Q1, F28P559SG8-Q1, F28P559SG2-Q1, F28P550SG9, F28P550SG8, F28P550SD7
64-pin PM F28P559SJ9-Q1, F28P559SJ6-Q1, F28P559SJ2-Q1, F28P550SJ9, F28P550SJ6, F28P559SG9-Q1, F28P559SG8-Q1, F28P559SG2-Q1, F28P550SG9, F28P550SG8, F28P550SD7
56-pin RSH - F28P550SJ9, F28P550SJ6, F28P550SG9 - F28P550SG9, F28P550SG8, F28P550SD7
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. For more information, see the C2000 Real-Time Control Peripherals Reference Guide.
(2) Time between start of sample-and-hold window to start of sample-and-hold window of the next conversion.
(3) The suffix -Q1 refers to AEC Q100 qualification for automotive applications.
(4) "-" on the feature entry indicates that the corresponding package type in not available.
(5) For devices that are available in more than one package, the peripheral count listed in the smaller package is reduced because the smaller package has less device pins available. The number of peripherals internally present on the device is not reduced compared to the largest package offered within a part number.