JAJSKY1B November   2017  – February 2023 DLP550JE

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Window Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Power Interface
      2. 7.2.2 Timing
    3. 7.3 Optical Interface and System Image Quality Considerations
      1. 7.3.1 Numerical Aperture and Stray Light Control
      2. 7.3.2 Pupil Match
      3. 7.3.3 Illumination Overfill
    4. 7.4 Micromirror Array Temperature Calculation
      1. 7.4.1 Micromirror Array Temperature Calculation
    5. 7.5 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 7.5.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.5.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.5.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.5.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 DMD Power-Up and Power-Down Procedures
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 サード・パーティ製品に関する免責事項
      2. 10.1.2 Device Nomenclature
      3. 10.1.3 Device Markings
    2. 10.2 サポート・リソース
      1. 10.2.1 Related Documentation
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.11 Micromirror Array Optical Characteristics

PARAMETERMINNOMMAXUNIT
Micromirror tilt angle, variation device to device (1)(2)(3)(4)111213degrees
Number of out-of-specification micromirrors (5)Adjacent micromirrors0micromirrors
Non-adjacent micromirrors10
(1) Measured relative to the plane formed by the overall micromirror array.
(2) Variation can occur between any two individual micromirrors located on the same device or located on different devices.
(3) Additional variation exists between the micromirror array and the package datums. See package drawing.
(4) See Figure 6-12.
(5) An out-of-specification micromirror is defined as a micromirror that is unable to transition between the two landed states.
GUID-85C26792-3417-4391-98CB-6979B3731B05-low.gif
Refer to section Micromirror Array Physical Characteristics table for M, N, and P specifications.
Figure 6-12 Micromirror Landed Orientation and Tilt