SWCU194 March 2023 CC1314R10 , CC1354P10 , CC1354R10 , CC2674P10 , CC2674R10
Figure 1-1 shows the building blocks of the CC13x4x10 and CC26x4x10 device platform.
The CC13x4x10 and CC26x4x10 device platform has the following features:
Arm® Cortex®-M33 Processor with DSP extensions, FPU and TrustZone®
For applications requiring extreme conservation of power, the CC13x4x10 and CC26x4x10 device platform features a power-management system to efficiently power down the devices to a low-power state during extended periods of inactivity. A power-up and power-down sequencer, a 32-bit sleep timer (an RTC) with interrupt, and ultra-low-leakage (ULL) RAM with retention in all power modes positions the MCU perfectly for battery applications.
In addition, the CC13x4x10 and CC26x4x10 device platform offers the advantages of the widely available development tools of Arm®, SoC infrastructure IP applications, and a large user community. Additionally, the microcontroller uses Arm® Thumb®-compatible Thumb-2 instruction set to reduce memory requirements and, thereby, cost.
TI offers a complete development environment to get to market quickly, with evaluation and development boards, white papers and application notes, an easy-to-use peripheral driver library, and a strong support, sales, and distributor network.