The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Part number | Order | Technology Family | VCC (Min) (V) | VCC (Max) (V) | Channels (#) | Inputs per channel | IOL (Max) (mA) | IOH (Max) (mA) | Input type | Output type | Features | Rating | Data rate (Max) (Mbps) | Operating temperature range (C) | Package size: mm2:W x L (PKG) | Package Group |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SN74LVC1G10 |
|
LVC | 1.65 | 5.5 | 1 | 3 | 32 | -32 | Standard CMOS | Push-Pull |
Partial Power Down (Ioff)
Over-Voltage Tolerant Inputs Ultra High Speed (tpd <5ns) |
Catalog | 100 |
-40 to 125
-40 to 85 |
6DSBGA: 1 mm2: .9 x 1.5 (DSBGA | 6)
6SC70: 4 mm2: 2.1 x 2 (SC70 | 6) 6SON: 1 mm2: 1 x 1 (SON | 6) 6SON: 1 mm2: 1 x 1.45 (SON | 6) 6SOT-23: 5 mm2: 1.6 x 2.9 (SOT-23 | 6) |
DSBGA | 6
SC70 | 6 SON | 6 SON | 6 SOT-23 | 6 |