TPS74701 (ACTIVE) Single-output 500mA LDO regulator, adjustable (0.8V to 3.6V), programmable soft start

 

Models (4)

Title Category Type Date
TPS74701 PSpice Transient Model (Rev. B) PSpice Model ZIP 09 Aug 2016
TPS74701 Unencrypted PSpice Transient Model PSpice Model ZIP 09 Aug 2016
TPS74701 TINA-TI Transient Reference Design TINA-TI Reference Design TSC 27 Oct 2010
TPS74701 TINA-TI Transient Spice Model TINA-TI Spice Model ZIP 27 Oct 2010

Design kits & evaluation modules (3)

Name Part# Type
J6Entry/RSP Infotainment (CPU+Display+JAMR3) Evaluation Module EVMX777G-01-20-00 Evaluation Modules & Boards
TMS320DM36x Evaluation Module TMDXEVM368 Evaluation Modules & Boards
TPS74701 Evaluation Module TPS74701EVM-177 Evaluation Modules & Boards

Reference designs

Copper-to-fiber 100BASE-FX or 1000BASE-X media converter reference design for grid applications

This reference design details a methodology to use the DP83849 evaluation board to implement a 10/100BASE-TX to 10/100BASE-FX media converter, which enables copper based legacy equipment to be easily connected to a fiber network. Copper based Ethernet (10/100BASE-TX) has been widely used in grid (...)

View the Important Notice for reference designs covering authorized use, intellectual property matters and disclaimers.

Description Part Number Company Tool Type
Reference Design for Telecom Applications (.9V @ .5A) PMP4742 Texas Instruments Reference designs
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Thermal calculator

Estimate the LDO IC temperature at your design conditions:
Part number
    Range
Vin  V
Vout  V
Iout  A
Ambient temp  °C
Package option
Voltage option
PCB construction
Enhanced Thermal = single thermal spreading plane of 1 oz Cu
Minimum Thermal = single thermal spreading plane of 1/2 oz Cu
View the user guide for more details.

Junction temperature vs. PCB copper coverage area
These are estimated power dissipation and thermal results.
Care must be taken to ensure that device junction temperature
does not exeed the maximum ratings as indicated in the datasheet.

This calculator uses the PCB copper area to estimate the device junction temperature. See notes on usage and calculation method.