Home Power management DC/DC power modules Power modules (integrated inductor)

TPS82693

ACTIVE

800-mA, High-Efficiency MicroSiP Step-Down Converter (Profile <1mm). Vout=2.85V with Spread Spectrum

Product details

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 0.8 Vin (min) (V) 2.3 Vin (max) (V) 4.8 Vout (min) (V) 2.85 Vout (max) (V) 2.85 Switching frequency (min) (kHz) 2700 Switching frequency (max) (kHz) 3300 Features Enable, Light Load Efficiency, Spread Spectrum Control mode Constant on-time (COT) Duty cycle (max) (%) 90
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 0.8 Vin (min) (V) 2.3 Vin (max) (V) 4.8 Vout (min) (V) 2.85 Vout (max) (V) 2.85 Switching frequency (min) (kHz) 2700 Switching frequency (max) (kHz) 3300 Features Enable, Light Load Efficiency, Spread Spectrum Control mode Constant on-time (COT) Duty cycle (max) (%) 90
uSIP (SIP) 8 6.67 mm² 2.3 x 2.9
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size < 6.7 mm2
  • 95% Efficiency at 3-MHz Operation
  • 23µA Quiescent Current
  • High Duty-Cycle Operation
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • Excellent AC Load Regulation
  • Internal Soft Start, 200-µs Start-Up Time
  • Integrated Active Power-Down Sequencing (Optional)
  • Current Overload and Thermal Shutdown Protection
  • Sub 1-mm Profile Solution

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS8269xSIP device is a complete 500 mA / 800 mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. The TPS8269xSIP is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSIP™ DC/DC converter operates at a regulated 3-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 23 µA (typical) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8269xSIP is packaged in a compact (2.9 mm × 2.3 mm) and low profile (1 mm) BGA package suitable for automated assembly by standard surface mount equipment.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet TPS8269x High-Efficiency MicroSIP Step-Down Converter (Profile <1 mm) datasheet (Rev. C) PDF | HTML 01 Apr 2015
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 16 Jun 2021
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 22 Jun 2018
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 24 Oct 2016
White paper SiP Power Modules White Paper 26 Jan 2016
EVM User's guide TPS82693EVM-207 User's Guide 16 Oct 2012
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 17 Jun 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Reference designs

TIDA-00088 — Complete reference design for TI's ONET parts in a 10G SFP+ LR Optical Module compatible form factor

This Texas Instruments Reference Design was designed to demonstrate the optical performance of the ONET1151L Laser Driver, the ONET8551T high gain Transimpedance Amplifier (TIA) and the ONET1151P Limiting Amplifier. It is available in a form factor that is compatible with 10.3125Gbps SFP+ LR (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
uSIP (SIP) 8 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos